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BAT54H

更新时间: 2024-11-11 08:48:43
品牌 Logo 应用领域
SECOS 肖特基二极管
页数 文件大小 规格书
2页 208K
描述
Surface Mount Schottky Barrier Diode

BAT54H 技术参数

生命周期:Contact Manufacturer包装说明:ROHS COMPLIANT, PLASTIC PACKAGE-2
针数:2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.70
风险等级:5.8配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
JESD-30 代码:R-PDSO-G2元件数量:1
端子数量:2最高工作温度:125 °C
最低工作温度:-55 °C最大输出电流:0.2 A
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE最大功率耗散:0.2 W
最大重复峰值反向电压:30 V最大反向恢复时间:0.005 µs
表面贴装:YES技术:SCHOTTKY
端子形式:GULL WING端子位置:DUAL

BAT54H 数据手册

 浏览型号BAT54H的Datasheet PDF文件第2页 
BAT54H  
30 Volt Silicon Hot-Carrier Detector  
Elektronische Bauelemente  
Surface Mount Schottky Barrier Diode  
RoHS Compliant Product  
A suffix of "-C" specifies halogen & lead-free  
FEATURES  
PACKAGE DIMENSIONS  
·
·
·
Low Turn-on Voltage  
SOD–323  
PLASTIC PACKAGE  
Extremely Fast Switching Speed  
PN Junction Guard Ring for Transient and  
ESD Protection  
K
A
MECHANICAL DATA  
·
·
Case: SOD-323, Molded Plastic  
Polarity: See Diagrams Below  
1
B
D
2
Mounting Position : Any  
Low Forward Voltage : 0.35 Volts (Typ) @ I  
Shipping : 3000 / Tape & Reel  
F = 10 mAdc  
E
C
1
2
1
H
J
CATHODE  
ANODE  
NOTE 3  
2
BAT54H Marking : J V  
L4  
,
PIN 1. CATHODE  
2. ANODE  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING  
WITH SOLDER PLATING.  
MAXIMUM RATINGS (T = 125°C unless otherwise noted)  
J
Symbol  
Rating  
Value  
Unit  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.071  
0.053  
0.039  
0.016  
V
R
Reverse Voltage  
30  
V
A
B
C
D
E
H
J
1.60  
1.15  
0.80  
0.25  
1.80 0.063  
1.35 0.045  
1.00 0.031  
0.40 0.010  
THERMAL CHARACTERISTICS  
Symbol  
Characteristic  
Max  
Unit  
0.15 REF  
0.006 REF  
0.00  
0.089  
2.30  
0.10 0.000  
0.177 0.0035 0.0070  
0.004  
P
D
Total Device Dissipation FR–5 Board,*  
200  
mW  
T
= 25°C  
K
2.70 0.091  
0.106  
A
Derate above 25°C  
1.57  
635  
150  
mW/°C  
°C/W  
°C  
R
Thermal Resistance Junction to Ambient  
Junction and Storage Temperature  
JA  
T , T  
J stg  
*FR–4 Minimum Pad  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Volts  
pF  
Reverse Breakdown Voltage (I = 10 µA)  
V
30  
R
(BR)R  
Total Capacitance (V = 1.0 V, f = 1.0 MHz)  
C
7.6  
10  
R
T
Reverse Leakage (V = 25 V)  
I
R
0.5  
2.0  
0.24  
0.5  
1.0  
5.0  
µAdc  
Vdc  
Vdc  
Vdc  
ns  
R
Forward Voltage (I = 0.1 mAdc)  
V
F
V
F
V
F
0.22  
0.41  
0.52  
F
Forward Voltage (I = 30 mAdc)  
F
Forward Voltage (I = 100 mAdc)  
F
Reverse Recovery Time  
(I = I = 10 mAdc, I  
t
rr  
= 1.0 mAdc) Figure 1  
F
R
R(REC)  
Forward Voltage (I = 1.0 mAdc)  
V
V
0.29  
0.35  
0.32  
0.40  
200  
300  
600  
Vdc  
Vdc  
F
F
Forward Voltage (I = 10 mAdc)  
F
F
Forward Current (DC)  
I
F
mAdc  
mAdc  
mAdc  
Repetitive Peak Forward Current  
I
FRM  
Non–Repetitive Peak Forward Current (t < 1.0 s)  
I
FSM  
http://www.SeCoSGmbH.com  
Any changing of specification will not be informed individual  
01-Jun-2005 Rev. B  
Page 1 of 2  

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