Datasheet > BAS40LTH

BAS40LTH

更新时间： 2024-10-30 14:53:15

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
5页	116K
描述
Small Signal Schottky Diode with TJ max. = 175 °C

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BAS40LTH 数据手册

BAS40LTH

Vishay Semiconductors

www.vishay.com

Small Signal Schottky Diode with T_Jmax. = 175 °C

FEATURES

Available

• T_Jmax. = 175 °C, rated for high temperature,

mission critical applications

• This device is protected by a PN junction guard

ring against excessive voltage, such as

electrostatic discharges

• Leadless ultra small DFN1006-2A package

(1 mm × 0.6 mm × 0.45 mm)

• Power dissipation better than SOT-23

LINKS TO ADDITIONAL RESOURCES

• Surface-mounted

device

(SMD)

plastic

package with visible and sidewall plated /

wettable flanks

3D Models

Models

Application

Notes

• Soldering can be checked by standard visual

inspection. No X-ray inspection necessary to meet

automotive AOI requirements

MECHANICAL DATA

Case: DFN1006-2A

Weight: 0.83 mg

• AEC-Q101 qualified available

Molding compound flammability rating: UL 94 V-0

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

Terminals: high temperature soldering guaranteed:

Peak temperature max. 260 °C

Packaging codes/options:

08/10K per 7" reel (8 mm tape)

PARTS TABLE

PART

ORDERING CODE

BAS40LTH-G3-08

BAS40LTH-HG3-08

AEC-Q101 QUALIFIED CIRCUIT CONFIGURATION TYPE MARKING

REMARKS

BAS40LTH

Single

Tape and reel

yes

ABSOLUTE MAXIMUM RATINGS (T_amb= 25 °C, unless otherwise specified)

PARAMETER

Reverse voltage

Forward current

TEST CONDITION

SYMBOL

VALUE

UNIT

V_R

I_F

200

500

200

500

350

1500

on FR-4 board with recommended soldering footprint

T_J= 25 °C, t_p= 10 ms

Non-repetitive peak forward current

Power dissipation

T_J= 100 °C, t_p= 10 ms

I_FSM

T_J= 125 °C, t_p= 20 μs

on FR-4 board with recommended soldering footprint

P_tot

R_thJL= 100 K/W

THERMAL CHARACTERISTICS (T_amb= 25 °C, unless otherwise specified)

PARAMETER

TEST CONDITION

SYMBOL

VALUE

UNIT

according to JEDEC^®51-3 on FR-4 board with

recommended soldering footprint

Thermal resistance junction to ambient air

R_thJA

420

K/W

Thermal resistance junction to lead

Maximum junction temperature

Storage temperature range

R_thJL

T_{j max.}

T_stg

100

K/W

°C

175

-55 to +175

°C

Operating temperature range

T_op

°C

Rev. 1.0, 12-Jul-2022

Document Number: 86328

For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5

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