BAS116T, BAW156T,
BAV170T, BAV199T
SURFACE MOUNT LOW LEAKAGE DIODE
Please click here to visit our online spice models database.
Features
Mechanical Data
•
•
•
•
•
Ultra-Small Surface Mount Package
Very Low Leakage Current
Lead Free/RoHS Compliant (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
"Green" Device (Notes 3 and 4)
•
•
Case: SOT-523
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
•
•
•
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
•
•
•
•
Polarity: See Diagrams Below
Marking Information: See Diagrams Below and Page 3
Ordering Information: See Page 2
Weight: 0.002 grams (approximate)
SOT-523
Top View
BAS116T Marking: 50
BAW156T Marking: 53
BAV170T Marking: 51
BAV199T Marking: 52
Maximum Ratings @T = 25°C unless otherwise specified
A
Characteristic
Symbol
VRRM
VRWM
VR
Value
85
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RMS Reverse Voltage
60
V
VR(RMS)
Forward Continuous Current (Note 1)
Single Diode
Double Diode
215
125
500
mA
mA
IFM
Repetitive Peak Forward Current
IFRM
4.0
1.0
0.5
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0ms
@ t = 1.0s
A
IFSM
Thermal Characteristics
Characteristic
Symbol
PD
Value
150
Unit
mW
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
833
°C/W
°C
Rθ
TJ, TSTG
JA
-65 to +150
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 5)
85
V
V(BR)R
⎯
⎯
IR = 100μA
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
0.90
1.0
1.1
Forward Voltage
V
VF
⎯
⎯
1.25
5.0
80
nA
nA
VR = 75V
Leakage Current (Note 5)
Total Capacitance
IR
CT
trr
⎯
⎯
⎯
⎯
2
VR = 75V, Tj = 150°C
VR = 0, f = 1.0MHz
IF = IR = 10mA,
pF
⎯
Reverse Recovery Time
3.0
⎯
μs
Irr = 0.1 x IR, RL = 100Ω
Notes: 1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
5. Short duration pulse test used to minimize self-heating effect.
BAS116T, BAW156T,
1 of 3
www.diodes.com
March 2009
© Diodes Incorporated
BAV170T, BAV199T
Document number: DS30258 Rev. 12 - 2