Datasheet > ARE1-9F30-00000

ARE1-9F30-00000

更新时间： 2022-05-14 22:18:11

品牌	Logo	应用领域
博通 - BOARDCOM		/
页数	文件大小	规格书
10页	853K
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High Power Infrared Emitting Diodes

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ARE1-9F30-00000 数据手册

ARE1-xxx0-00000 Data Sheet

High Power Infrared Emitting Diodes

Precautionary Notes

cleaning, rub the surface gently without putting too

much pressure on the silicone. Ultrasonic cleaning is

not recommended.

Reflow Soldering



Do not perform reflow soldering more than twice.

Observe necessary precautions of handling

moisture-sensitive devices as stated in Handling of

Moisture-Sensitive Devices.

Handling of Moisture-Sensitive Devices



Do not apply any pressure or force on the LED during

reflow and after reflow when the LED is still hot.

This product has a Moisture Sensitive Level 3 rating per

JEDEC J-STD-020. Refer to Broadcom Application Note

AN5305, Handling of Moisture Sensitive Surface Mount

Devices, for additional details and a review of proper

handling procedures.

Figure 16: Recommended Lead-Free Reflow Soldering Profile

10 to 30 SEC.

Before use:

255 – 260°C

3°C/SEC. MAX.



An unopened moisture barrier bag (MBB) can be stored

at <40°C/90% RH for 12 months. If the actual shelf life

has exceeded 12 months and the humidity indicator

card (HIC) indicates that baking is not required, it is

safe to reflow the LEDs per the original MSL rating.

217°C

200°C

6°C/SEC. MAX.

150°C

3°C/SEC. MAX.



Do not open the MBB prior to assembly (for example,

for IQC). If unavoidable, MBB must be properly

resealed with fresh desiccant and HIC. The exposed

duration must be taken in as floor life.

60 – 120 SEC.

100 SEC. MAX.

TIME

Control after opening the MBB:

Handling Precautions



Read the HIC immediately upon opening of MBB.

Keep the LEDs at <30°/60% RH at all times, and

complete all high temperature-related processes,

including soldering, curing, or rework within 168 hours.

The encapsulation material of the LED is made of silicone

for better product reliability. Compared to epoxy

encapsulant, which is hard and brittle, silicone is softer and

flexible. Observe special handling precautions during

assembly of silicone encapsulated LED products. Failure to

comply might lead to damage and premature failure of the

Control for unfinished reel:

Store unused LEDs in a sealed MBB with desiccant or a

desiccator at <5% RH.

LED. Refer to Broadcom Application Note AN5288,

Silicone Encapsulation for LED: Advantages and Handling

Control of assembled boards:

Precautions, for additional information.

If the PCB soldered with the LEDs is to be subjected to other

high-temperature processes, store the PCB in a sealed

MBB with desiccant or desiccator at <5% RH to ensure that

all LEDs have not exceeded their floor life of 168 hours.



Do not poke sharp objects into the silicone encapsulant.

Sharp objects, such as tweezers or syringes, might

apply excessive force or even pierce through the

silicone and induce failures to the LED die or wire bond.



Do not touch the silicone encapsulant. Uncontrolled

force acting on the silicone encapsulant might result in

excessive stress on the wire bond. Hold the LED only

by the body.

Baking is required if the following conditions exist:



The HIC indicator indicates a change in color for 10%

and 5%, as stated on the HIC.

The LEDs are exposed to conditions of >30°C/60% RH

at any time.



Do not stack assembled PCBs together. Use an

appropriate rack to hold the PCBs.

The LED's floor life exceeded 168 hours.

The surface of silicone material attracts dust and dirt

easier than epoxy due to its surface tackiness. To

remove foreign particles on the surface of silicone, use

a cotton bud with isopropyl alcohol (IPA). During

The recommended baking condition is: 60°C ± 5ºC for

20 hours. Baking can only be done once.

Broadcom

ARE1-xxx0-DS100

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