是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 包装说明: | FLANGE MOUNT, R-XUFM-X25 |
针数: | 25 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | 风险等级: | 5.21 |
Is Samacsys: | N | 其他特性: | AVALANCHE RATED |
外壳连接: | ISOLATED | 最大集电极电流 (IC): | 100 A |
集电极-发射极最大电压: | 600 V | 配置: | COMMON COLLECTOR, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR |
JESD-30 代码: | R-XUFM-X25 | JESD-609代码: | e1 |
湿度敏感等级: | 1 | 元件数量: | 2 |
端子数量: | 25 | 最高工作温度: | 175 °C |
封装主体材料: | UNSPECIFIED | 封装形状: | RECTANGULAR |
封装形式: | FLANGE MOUNT | 峰值回流温度(摄氏度): | NOT SPECIFIED |
极性/信道类型: | N-CHANNEL | 认证状态: | Not Qualified |
表面贴装: | NO | 端子面层: | TIN SILVER COPPER |
端子形式: | UNSPECIFIED | 端子位置: | UPPER |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 晶体管应用: | POWER CONTROL |
晶体管元件材料: | SILICON | 标称断开时间 (toff): | 310 ns |
标称接通时间 (ton): | 170 ns | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
APTGT75DDA60T3G-Module | MICROCHIP |
获取价格 |
Configuration: Dual boost chopperVCES (V): 600VCESat (V): 1.5Current (A) Tc=80C: 75Silicon | |
APTGT75DH120T | ADPOW |
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Asymmetrical - Bridge Fast Trench + Field Stop IGBT Power Module | |
APTGT75DH120T3G | MICROSEMI |
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Asymmetrical - Bridge Fast Trench + Field Stop IGBT Power Module | |
APTGT75DH120T3G-Module | MICROCHIP |
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Configuration: Asymmetrical bridgeVCES (V): 1200VCESat (V): 1.7Current (A) Tc=80C: 75Silic | |
APTGT75DH120TG | MICROSEMI |
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Asymmetrical - Bridge Fast Trench + Field Stop IGBT Power Module | |
APTGT75DH60T1G | MICROSEMI |
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Asymmetrical - Bridge Trench + Field Stop IGBT Power Module | |
APTGT75DH60T3G | MICROSEMI |
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Asymmetrical - Bridge Trench + Field Stop IGBT Power Module | |
APTGT75DH60TG | MICROSEMI |
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Asymmetrical - Bridge Trench + Field Stop IGBT Power Module | |
APTGT75DSK60T3 | ADPOW |
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Dual Buck chopper Trench + Field Stop IGBT Power Module | |
APTGT75DSK60T3G | MICROSEMI |
获取价格 |
Dual Buck chopper Trench + Field Stop IGBT Power Module |