是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | MODULE |
包装说明: | MODULE-14 | 针数: | 14 |
Reach Compliance Code: | unknown | 风险等级: | 5.21 |
外壳连接: | ISOLATED | 最大集电极电流 (IC): | 225 A |
集电极-发射极最大电压: | 600 V | 配置: | PARALLEL, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR |
门极-发射极最大电压: | 20 V | JESD-30 代码: | R-XUFM-X14 |
JESD-609代码: | e0 | 元件数量: | 2 |
端子数量: | 14 | 最高工作温度: | 175 °C |
封装主体材料: | UNSPECIFIED | 封装形状: | RECTANGULAR |
封装形式: | FLANGE MOUNT | 峰值回流温度(摄氏度): | NOT SPECIFIED |
极性/信道类型: | N-CHANNEL | 最大功率耗散 (Abs): | 480 W |
认证状态: | Not Qualified | 子类别: | Insulated Gate BIP Transistors |
表面贴装: | NO | 端子面层: | TIN LEAD |
端子形式: | UNSPECIFIED | 端子位置: | UPPER |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 晶体管应用: | POWER CONTROL |
晶体管元件材料: | SILICON | 标称断开时间 (toff): | 370 ns |
标称接通时间 (ton): | 180 ns | VCEsat-Max: | 1.9 V |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
APTGT150DH60TG | MICROSEMI |
获取价格 |
Asymmetrical - Bridge Trench + Field Stop IGBT Power Module | |
APTGT150DH60TG-Module | MICROCHIP |
获取价格 |
Configuration: Asymmetrical bridgeVCES (V): 600VCESat (V): 1.5Current (A) Tc=80C: 150Silic | |
APTGT150DU120 | ADPOW |
获取价格 |
Dual common source Fast Trench + Field Stop IGBT Power Module | |
APTGT150DU120G | MICROSEMI |
获取价格 |
Dual common source Fast Trench + Field Stop IGBT Power Module | |
APTGT150DU120G-Module | MICROCHIP |
获取价格 |
Configuration: Dual common sourceVCES (V): 1200VCESat (V): 1.7Current (A) Tc=80C: 150Silic | |
APTGT150DU120T | ADPOW |
获取价格 |
Dual common source Fast Trench + Field Stop IGBT Power Module | |
APTGT150DU120TG | MICROSEMI |
获取价格 |
Dual common source Fast Trench + Field Stop IGBT Power Module | |
APTGT150DU120TG-Module | MICROCHIP |
获取价格 |
Configuration: Dual common sourceVCES (V): 1200VCESat (V): 1.7Current (A) Tc=80C: 150Silic | |
APTGT150DU170 | ADPOW |
获取价格 |
Dual common source Trench + Field Stop IGBT Power Module | |
APTGT150DU170G | MICROSEMI |
获取价格 |
Dual common source Trench + Field Stop IGBT Power Module |