APT30GS60BRDQ2(G)
APT30GS60SRDQ2(G)
600V, 30A, V
= 2.8V Typical
CE(ON)
Thunderbolt® High Speed NPT IGBT with Anti-Parallel 'DQ' Diode
The Thunderbolt HS™ series is based on thin wafer non-punch through (NPT) technology similar to
the Thunderbolt® series, but trades higher VCE(ON) for significantly lower turn-on energy Eoff. The low
switching losses enable operation at switching frequencies over 100kHz, approaching power MOSFET
performance but lower cost.
An extremely tight parameter distribution combined with a positive VCE(ON) temperature coefficient
make it easy to parallel Thunderbolts HS™ IGBT's. Controlled slew rates result in very good noise
and oscillation immunity and low EMI. The short circuit duration rating of 10µs make these IGBT's
suitable for motor drive and inverter applications. Reliability is further enhanced by avalanche energy
ruggedness. Combi versions are packaged with a high speed, soft recovery DQ series diode.
D3PAK
APT30GS60BRDQ2(G)
APT30GS60SRDQ2(G)
Features
Typical Applications
• Fast Switching with low EMI
• Very Low EOFF for Maximum Efficiency
• ZVS Phase Shifted and other Full Bridge
• Half Bridge
Single die
IGBT with
separate DQ
diode die
• Short circuit rated
• Low Gate Charge
• High Power PFC Boost
• Welding
• Tight parameter distribution
• Easy paralleling
• Induction heating
• High Frequency SMPS
• RoHS Compliant
Absolute Maximum Ratings
Symbol Parameter
Rating
Unit
A
Continuous Collector Current T = @ 25°C
IC1
IC2
54
30
C
Continuous Collector Current T = @ 100°C
C
1
ICM
VGE
Pulsed Collector Current
113
±30V
113
165
Gate-Emitter Voltage
V
SSOA
EAS
Switching Safe Operating Area
2
Single Pulse Avalanche Energy
mJ
µs
3
tSC
Short Circut Withstand Time
10
90
55
T
T
= 25°C
C
C
IF
Diode Continuous Forward Current
= 100°C
A
IFRM
Diode Max. Repetitive Forward Current
113
Thermal and Mechanical Characteristics
Symbol Parameter
Min
Typ
Max
250
0.50
0.67
-
Unit
PD
Total Power Dissipation T = @ 25°C
C
-
-
-
-
W
IGBT
RθJC
Junction to Case Thermal Resistance
Diode
°C/W
RθCS
TJ, TSTG
TL
Case to Sink Thermal Resistance, Flat Greased Surface
Operating and Storage Junction Temperature Range
-
0.11
-55
-
150
300
-
°C
Soldering Temperature for 10 Seconds (1.6mm from case)
Package Weight
-
-
-
-
-
-
0.22
5.9
-
oz
g
WT
-
10
in·lbf
N·m
Torque Mounting Torque (TO-247), 6-32 M3 Screw
-
1.1
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should be Followed.
Microsemi Website - http://www.microsemi.com