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APT30GS60SRDQ2G PDF预览

APT30GS60SRDQ2G

更新时间: 2024-11-27 06:37:27
品牌 Logo 应用领域
美高森美 - MICROSEMI 二极管双极性晶体管
页数 文件大小 规格书
7页 591K
描述
Thunderbolt High Speed NPT IGBT with Anti-Parallel DQ Diode

APT30GS60SRDQ2G 数据手册

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APT30GS60BRDQ2(G)  
APT30GS60SRDQ2(G)  
600V, 30A, V  
= 2.8V Typical  
CE(ON)  
Thunderbolt® High Speed NPT IGBT with Anti-Parallel 'DQ' Diode  
The Thunderbolt HSseries is based on thin wafer non-punch through (NPT) technology similar to  
the Thunderbolt® series, but trades higher VCE(ON) for significantly lower turn-on energy Eoff. The low  
switching losses enable operation at switching frequencies over 100kHz, approaching power MOSFET  
performance but lower cost.  
An extremely tight parameter distribution combined with a positive VCE(ON) temperature coefficient  
make it easy to parallel Thunderbolts HSIGBT's. Controlled slew rates result in very good noise  
and oscillation immunity and low EMI. The short circuit duration rating of 10µs make these IGBT's  
suitable for motor drive and inverter applications. Reliability is further enhanced by avalanche energy  
ruggedness. Combi versions are packaged with a high speed, soft recovery DQ series diode.  
D3PAK  
APT30GS60BRDQ2(G)  
APT30GS60SRDQ2(G)  
Features  
Typical Applications  
• Fast Switching with low EMI  
• Very Low EOFF for Maximum Efficiency  
• ZVS Phase Shifted and other Full Bridge  
• Half Bridge  
Single die  
IGBT with  
separate DQ  
diode die  
• Short circuit rated  
• Low Gate Charge  
• High Power PFC Boost  
• Welding  
• Tight parameter distribution  
• Easy paralleling  
• Induction heating  
• High Frequency SMPS  
• RoHS Compliant  
Absolute Maximum Ratings  
Symbol Parameter  
Rating  
Unit  
A
Continuous Collector Current T = @ 25°C  
IC1  
IC2  
54  
30  
C
Continuous Collector Current T = @ 100°C  
C
1
ICM  
VGE  
Pulsed Collector Current  
113  
±30V  
113  
165  
Gate-Emitter Voltage  
V
SSOA  
EAS  
Switching Safe Operating Area  
2
Single Pulse Avalanche Energy  
mJ  
µs  
3
tSC  
Short Circut Withstand Time  
10  
90  
55  
T
T
= 25°C  
C
C
IF  
Diode Continuous Forward Current  
= 100°C  
A
IFRM  
Diode Max. Repetitive Forward Current  
113  
Thermal and Mechanical Characteristics  
Symbol Parameter  
Min  
Typ  
Max  
250  
0.50  
0.67  
-
Unit  
PD  
Total Power Dissipation T = @ 25°C  
C
-
-
-
-
W
IGBT  
RθJC  
Junction to Case Thermal Resistance  
Diode  
°C/W  
RθCS  
TJ, TSTG  
TL  
Case to Sink Thermal Resistance, Flat Greased Surface  
Operating and Storage Junction Temperature Range  
-
0.11  
-55  
-
150  
300  
-
°C  
Soldering Temperature for 10 Seconds (1.6mm from case)  
Package Weight  
-
-
-
-
-
-
0.22  
5.9  
-
oz  
g
WT  
-
10  
in·lbf  
N·m  
Torque Mounting Torque (TO-247), 6-32 M3 Screw  
-
1.1  
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should be Followed.  
Microsemi Website - http://www.microsemi.com  

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