是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 包装说明: | HTFQFP, QFP80,.55SQ,20 |
Reach Compliance Code: | compliant | ECCN代码: | 5A991.B.1 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 0.71 | 模拟输入最大值: | 3.45 V |
JESD-30 代码: | S-PQFP-G80 | JESD-609代码: | e4 |
长度: | 12 mm | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 80 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HTFQFP |
封装等效代码: | QFP80,.55SQ,20 | 封装形状: | SQUARE |
封装形式: | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
座面最大高度: | 1.2 mm | 表面贴装: | YES |
电信集成电路类型: | TELECOM CIRCUIT | 温度等级: | INDUSTRIAL |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 12 mm |
Base Number Matches: | 1 |
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