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ADCLK950 PDF预览

ADCLK950

更新时间: 2024-02-22 03:13:02
品牌 Logo 应用领域
亚德诺 - ADI 半导体时钟
页数 文件大小 规格书
12页 368K
描述
Two Selectable Inputs, 10 LVPECL Outputs, SiGe Clock Fanout Buffer

ADCLK950 技术参数

生命周期:Active零件包装代码:QFN
包装说明:HVQCCN,针数:40
Reach Compliance Code:unknown风险等级:5.76
系列:950输入调节:DIFFERENTIAL
JESD-30 代码:S-XQCC-N40长度:6 mm
逻辑集成电路类型:LOW SKEW CLOCK DRIVER功能数量:1
反相输出次数:端子数量:40
实输出次数:10最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装代码:HVQCCN封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE传播延迟(tpd):0.21 ns
认证状态:COMMERCIALSame Edge Skew-Max(tskwd):0.045 ns
座面最大高度:1 mm最大供电电压 (Vsup):3.63 V
最小供电电压 (Vsup):2.97 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:BIPOLAR
温度等级:INDUSTRIAL端子面层:NOT SPECIFIED
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD宽度:6 mm
Base Number Matches:1

ADCLK950 数据手册

 浏览型号ADCLK950的Datasheet PDF文件第6页浏览型号ADCLK950的Datasheet PDF文件第7页浏览型号ADCLK950的Datasheet PDF文件第8页浏览型号ADCLK950的Datasheet PDF文件第9页浏览型号ADCLK950的Datasheet PDF文件第11页浏览型号ADCLK950的Datasheet PDF文件第12页 
ADCLK950  
return path. If the inputs are dc-coupled to a source, take care to  
ensure that the pins are within the rated input differential and  
common-mode ranges.  
CLOCK INPUT SELECT (IN_SEL) SETTINGS  
A Logic 0 on the IN_SEL pin selects the Input CLK0 and  
Input  
. A Logic 1 on the IN_SEL pin selects Input CLK1  
CLK0  
If the return is floated, the device exhibits a 100 ꢁ cross termi-  
nation, but the source must then control the common-mode  
voltage and supply the input bias currents.  
and Input  
.
CLK1  
PCB LAYOUT CONSIDERATIONS  
The ADCLK950 buffer is designed for very high speed applica-  
tions. Consequently, high speed design techniques must be used  
to achieve the specified performance. It is critically important  
to use low impedance supply planes for both the negative supply  
(VEE) and the positive supply (VCC) planes as part of a multilayer  
board. Providing the lowest inductance return path for switching  
currents ensures the best possible performance in the target  
application.  
There are ESD/clamp diodes between the input pins to prevent  
the application from developing excessive offsets to the input  
transistors. ESD diodes are not optimized for best ac perfor-  
mance. When a clamp is required, it is recommended that  
appropriate external diodes be used.  
Exposed Metal Paddle  
The exposed metal paddle on the ADCLK950 package is both  
an electrical connection and a thermal enhancement. For the  
device to function properly, the paddle must be properly  
attached to the VEE power plane.  
The following references to the GND plane assume that the VEE  
power plane is grounded for LVPECL operation. Note that for  
ECL operation, the VCC power plane becomes the ground plane.  
When properly mounted, the ADCLK950 also dissipates heat  
through its exposed paddle. The PCB acts as a heat sink for the  
ADCLK950. The PCB attachment must provide a good thermal  
path to a larger heat dissipation area. This requires a grid of vias  
from the top layer down to the VEE power plane (see Figure 18).  
The ADCLK950 evaluation board (ADCLK950/PCBZ) pro-  
vides an example of how to attach the part to the PCB.  
It is also important to adequately bypass the input and output  
supplies. Place a 1 μF electrolytic bypass capacitor within several  
inches of each VCC power supply pin to the GND plane. In  
addition, place multiple high quality 0.001 μF bypass capacitors  
as close as possible to each of the VCC supply pins, and connect  
the capacitors to the GND plane with redundant vias. Carefully  
select high frequency bypass capacitors for minimum induc-  
tance and ESR. To improve the effectiveness of the bypass at  
high frequencies, minimize parasitic layout inductance. Also,  
avoid discontinuities along input and output transmission lines  
that can affect jitter performance.  
VIAS TO V POWER  
EE  
In a 50 Ω environment, input and output matching have a  
significant impact on performance. The buffer provides internal  
PLANE  
CLKx  
50 Ω termination resistors for both CLKx and  
inputs.  
Normally, the return side is connected to the reference pin that is  
provided. Carefully bypass the termination potential using  
ceramic capacitors to prevent undesired aberrations on the  
input signal due to parasitic inductance in the termination  
Figure 18. PCB Land for Attaching Exposed Paddle  
Rev. 0 | Page 10 of 12  
 
 

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