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ADCLK914BCPZ-WP PDF预览

ADCLK914BCPZ-WP

更新时间: 2024-01-12 22:29:47
品牌 Logo 应用领域
亚德诺 - ADI 缓冲放大器放大器电路信息通信管理时钟
页数 文件大小 规格书
12页 304K
描述
Ultrafast, SiGe, Open-Collector HVDS Clock/Data Buffer

ADCLK914BCPZ-WP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN,针数:16
Reach Compliance Code:unknown风险等级:5.7
Is Samacsys:N放大器类型:BUFFER
JESD-30 代码:S-XQCC-N16JESD-609代码:e3
长度:3 mm湿度敏感等级:NOT APPLICABLE
功能数量:1端子数量:16
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER
峰值回流温度(摄氏度):260认证状态:COMMERCIAL
座面最大高度:0.9 mm子类别:Buffer Amplifier
供电电压上限:6 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:BICMOS
温度等级:AUTOMOTIVE端子面层:MATTE TIN
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:40
宽度:3 mmBase Number Matches:1

ADCLK914BCPZ-WP 数据手册

 浏览型号ADCLK914BCPZ-WP的Datasheet PDF文件第3页浏览型号ADCLK914BCPZ-WP的Datasheet PDF文件第4页浏览型号ADCLK914BCPZ-WP的Datasheet PDF文件第5页浏览型号ADCLK914BCPZ-WP的Datasheet PDF文件第7页浏览型号ADCLK914BCPZ-WP的Datasheet PDF文件第8页浏览型号ADCLK914BCPZ-WP的Datasheet PDF文件第9页 
ADCLK914  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
PIN 1  
INDICATOR  
12 Q  
11 Q  
10 NC  
D
D
1
2
3
4
ADCLK914  
NC  
NC  
TOP VIEW  
(Not to Scale)  
9
NC  
NC = NO CONNECT  
Figure 2. Pin Configuration  
Table 4. Pin Function Descriptions  
Pin No.  
Mnemonic  
Description  
1
2
D
D
Noninverting Input.  
Inverting Input.  
3, 4, 5, 6, 9, 10 NC  
No Connect. No physical connection to the die.  
Negative Supply Voltage.  
Positive Supply Voltage.  
ꢀ, 14  
8, 13  
11  
VEE  
VCC  
Q
Inverting Output.  
12  
Q
Noninverting Output.  
15  
16  
VREF  
VT  
Reference Voltage. Reference voltage for biasing ac-coupled inputs.  
Center Tap. Center tap of 100 Ω input resistor.  
Heat Sink/  
Exposed Pad  
NC  
No Connect. The metallic back surface of the package is not electrically connected to any part of the circuit.  
It can be left floating for optimal electrical isolation between the package handle and the substrate of the  
die. It can also be soldered to ground on the application board if improved thermal and/or mechanical  
stability is needed. Exposed metal at the corners of the package is connected to this back surface. Allow  
sufficient clearance for vias and other components.  
Rev. A | Page 6 of 12  
 

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