ADCLK914
ABSOLUTE MAXIMUM RATINGS
Table 2.
Values of θJA are provided for package comparison and PCB
Parameter
Rating
design considerations. θJA can be used for a first-order
Supply Voltage (VCC to GND)
Input Voltage
Maximum Output Voltage
Minimum Output Voltage
Input Termination
6.0 V
approximation of TJ by the equation
−0.5 V to VCC + 0.5 V
VCC + 0.5 V
VEE − 0.5 V
2 V
VCC − VEE
−40°C to +125°C
150°C
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJB are provided for package comparison and PCB
design considerations.
Voltage Reference
Operating Temperature Range, Ambient
Operating Temperature, Junction
Storage Temperature Range
Table 3. Thermal Parameters for ADCLK914 16-Lead LFCSP
Symbol Description1
Value Units
−65°C to +150°C
Junction-to-ambient thermal
resistance, 0.0 meters per sec air
flow per JEDEC JESD51-2 (still air)
ꢀ8.4
68.5
61.4
48.8
1.5
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
θJA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Junction-to-ambient thermal
resistance, 1.0 meter per sec air flow
per JEDEC JESD51-6 (moving air)
θJMA
θJMA
θJB
Junction-to-ambient thermal
resistance, 2.5 m/s air flow per
JEDEC JESD51-6 (moving air)
Junction-to-board thermal
resistance, 1.0 meter per sec air flow
per JEDEC JESD51-8 (moving air)
THERMAL PERFORMANCE
The ADCLK914 is specified for a case temperature (TCASE). To
ensure that TCASE is not exceeded, use an airflow source.
Junction-to-case thermal resistance
(die-to-heatsink) per MIL-Std 883,
Method 1012.1
θJC
To determine the junction temperature on the application PCB
Junction-to-top-of-package
characterization parameter, 0
meters per sec air flow per JEDEC
JESD51-2 (still air)
2.0
ΨJT
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
1 Descriptions based on using a 2s2p test board.
TCASE is the case temperature (°C) measured by the customer at
top center of package.
ESD CAUTION
ΨJT is determined by the values listed in Table 3.
PD is the power dissipation.
Rev. A | Page 5 of 12