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A43E16321G-95F PDF预览

A43E16321G-95F

更新时间: 2024-02-03 05:34:08
品牌 Logo 应用领域
联笙电子 - AMICC 时钟动态存储器内存集成电路
页数 文件大小 规格书
45页 724K
描述
Synchronous DRAM, 2MX32, 7ns, CMOS, PBGA90, CSP-90

A43E16321G-95F 技术参数

是否Rohs认证: 符合生命周期:Contact Manufacturer
包装说明:LFBGA, BGA90,9X15,32Reach Compliance Code:unknown
风险等级:5.75访问模式:FOUR BANK PAGE BURST
最长访问时间:7 ns其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):105 MHzI/O 类型:COMMON
交错的突发长度:1,2,4,8JESD-30 代码:R-PBGA-B90
长度:13 mm内存密度:67108864 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:32
功能数量:1端口数量:1
端子数量:90字数:2097152 words
字数代码:2000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:2MX32输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装等效代码:BGA90,9X15,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH电源:1.8 V
认证状态:Not Qualified刷新周期:4096
座面最大高度:1.4 mm自我刷新:YES
连续突发长度:1,2,4,8,FP最大待机电流:0.00001 A
子类别:DRAMs最大压摆率:0.1 mA
最大供电电压 (Vsup):1.95 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM宽度:8 mm
Base Number Matches:1

A43E16321G-95F 数据手册

 浏览型号A43E16321G-95F的Datasheet PDF文件第6页浏览型号A43E16321G-95F的Datasheet PDF文件第7页浏览型号A43E16321G-95F的Datasheet PDF文件第8页浏览型号A43E16321G-95F的Datasheet PDF文件第10页浏览型号A43E16321G-95F的Datasheet PDF文件第11页浏览型号A43E16321G-95F的Datasheet PDF文件第12页 
A43E16321  
Simplified Truth Table  
Command  
CKEn-1 CKEn  
DQM BA0, A10 A9~A0 Notes  
CAS  
CS  
WE  
RAS  
BA1  
/AP  
Register  
Mode Register Set  
1,2  
H
H
X
X
L
L
L
L
L
L
L
L
X
L
OP CODE  
OP CODE  
Extended Mode Register Set  
1,2  
3
Refresh  
Auto Refresh  
Self  
H
L
H
L
L
L
L
H
H
X
X
X
Entry  
Exit  
3
H
H
3
Refresh  
L
H
X
X
X
H
L
X
L
X
H
X
H
3
4
Bank Active & Row Addr.  
H
V
V
Row Addr.  
Read &  
Column Addr.  
Auto Precharge Disable  
Auto Precharge Enable  
Auto Precharge Disable  
Auto Precharge Enable  
L
H
L
Column  
Addr.  
4
4,5  
4
H
X
L
H
L
H
X
Write &  
Column  
Addr.  
H
H
X
X
L
L
H
H
L
L
L
X
X
V
Column Addr.  
H
4,5  
6
Burst Stop  
Precharge  
H
X
Bank Selection  
Both Banks  
V
X
L
H
X
L
L
H
L
X
X
H
L
H
X
L
H
X
X
H
X
V
X
X
H
X
H
X
H
X
X
H
X
V
X
H
X
X
H
X
V
X
Entry  
H
L
L
H
L
X
X
X
Clock Suspend or  
Active Power Down  
X
X
Exit  
Entry  
H
H
L
Precharge Power Down Mode  
Exit  
L
H
H
H
X
X
V
X
H
DQM  
X
X
7
8
L
H
L
H
X
H
X
H
X
L
No Operation Command  
Deep Power Down Entry  
Deep Power Down Exit  
H
L
L
X
X
X
X
H
X
X
(V = Valid, X = Don’t Care, H = Logic High, L = Logic Low)  
Note : 1. OP Code: Operand Code  
A0~A10, BA0, BA1: Program keys. (@MRS, EMRS)  
2. MRS can be issued only when all banks are at precharge state.  
A new command can be issued after 2 clock cycle of MRS, EMRS.  
3. Auto refresh functions is same as CBR refresh of DRAM.  
The automatical precharge without Row precharge command is meant by “Auto”.  
Auto/Self refresh can be issued only when all banks are at precharge state.  
4. BA : Bank select address.  
5. During burst read or write with auto precharge, new read/write command cannot be issued.  
Another bank read/write command can be issued at every burst length.  
6. Bust stop command is valid at every burst length.  
7. DQM sampled at positive going edge of a CLK masks the data-in at the very CLK (Write DQM latency is 0)  
but masks the data-out Hi-Z state after 2 CLK cycles. (Read DQM latency is 2)  
8. After Deep Power Down mode exit, a full new initialization of the memory device is mandatory.  
PRELIMINARY (February, 2008, Version 0.1)  
8
AMIC Technology, Corp.  

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