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935322088699 PDF预览

935322088699

更新时间: 2024-09-20 19:08:51
品牌 Logo 应用领域
恩智浦 - NXP 微控制器外围集成电路
页数 文件大小 规格书
168页 1586K
描述
RISC Microcontroller

935322088699 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:unknown风险等级:5.67
uPs/uCs/外围集成电路类型:MICROCONTROLLER, RISCBase Number Matches:1

935322088699 数据手册

 浏览型号935322088699的Datasheet PDF文件第2页浏览型号935322088699的Datasheet PDF文件第3页浏览型号935322088699的Datasheet PDF文件第4页浏览型号935322088699的Datasheet PDF文件第5页浏览型号935322088699的Datasheet PDF文件第6页浏览型号935322088699的Datasheet PDF文件第7页 
NXP Semiconductors  
Data Sheet: Technical Data  
Document Number: MPC5777M  
Rev. 6, 06/2016  
MPC5777M  
416 TEPBGA  
27mm x 27 mm  
512 TEPBGA  
MPC5777M Microcontroller  
Data Sheet  
25 mm x 25 mm  
• Three main CPUs, single issue, 32-bit CPU core complexes  
(e200z7), one of which is a dedicated lockstep core.  
– Dual phase-locked loops with stable clock domain for  
peripherals and FM modulation domain for  
computational shell  
®
– Power Architecture embedded specification  
compliance  
• Dual crossbar switch architecture for concurrent access to  
peripherals, flash, or RAM from multiple bus masters with  
end-to-end ECC  
• Hardware Security Module (HSM) to provide robust  
integrity checking of flash memory  
• System Integration Unit Lite (SIUL)  
• Boot Assist Module (BAM) supports factory programming  
using serial bootload through ‘UART Serial Boot Mode  
Protocol’. Physical interface (PHY) can be:  
– UART/LIN  
– Instruction set enhancement allowing variable length  
encoding (VLE), encoding a mix of 16-bit and 32-bit  
instructions, for code size footprint reduction  
– Single-precision floating point operations  
– 16 KB Local instruction RAM and 64 KB local data  
RAM  
– 16 KB I-Cache and 4 KB D-Cache  
• I/O Processor, dual issue, 32-bit CPU core complex  
(e200z4), with  
– Power Architecture embedded specification compliance  
– Instruction set enhancement allowing variable length  
encoding (VLE), encoding a mix of 16-bit and 32-bit  
instructions, for code size footprint reduction  
– Single-precision floating point operations  
– Lightweight Signal Processing Auxiliary Processing  
Unit (LSP APU) instruction support for digital signal  
processing (DSP)  
– CAN  
• GTM104 — generic timer module  
• Enhanced analog-to-digital converter system with  
– Twelve separate 12-bit SAR analog converters  
– Ten separate 16-bit Sigma-Delta analog converters  
• Eight deserial serial peripheral interface (DSPI) modules  
• Two Peripheral Sensor Interface (PSI5) controllers  
• Three LIN and three UART communication interface  
(LINFlexD) modules (6 total)  
– 16 KB Local instruction RAM and 64 KB local data  
RAM  
– LINFlexD_0 is a Master/Slave  
– 8 KB I-Cache  
• 8640 KB on-chip flash  
– LINFlexD_1, LINFlexD_2, LINFlexD_14,  
LINFlexD_15, and LINFlexD_16 are Masters  
• Four modular controller area network (MCAN) modules  
and one time-triggered controller area network  
(M-TTCAN)  
– Supports read during program and erase operations, and  
multiple blocks allowing EEPROM emulation  
• 404 KB on-chip general-purpose SRAM including 64 KB  
standby RAM (+ 192 KB data RAM included in the  
CPUs). Of this 404 KB, 64 KB can be powered by a  
separate supply so the contents of this portion can be  
preserved when the main MCU is powered down.  
• Multichannel direct memory access controllers (eDMA): 2  
x 64 channels per eDMA (128 channels total)  
• Triple Interrupt controller (INTC)  
• External Bus Interface (EBI)  
– Dual routing of accesses to EBI  
– Access path determined by access address  
– Access path downstream of PFLASH controller  
– Allows EBI accesses to share buffer and prefetch  
capabilities of internal flash  
– Allows internal flash accesses to be remapped to  
memories connected to EBI  
NXP reserves the right to change the detail specifications as may be required to permit  
improvements in the design of its products.  

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