Datasheet > 935319782518

935319782518

更新时间： 2024-09-20 19:58:39

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
173页	2421K
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Multifunction Peripheral

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935319782518 技术参数

生命周期：	Active	Reach Compliance Code：	unknown
风险等级：	5.75	Base Number Matches：	1

935319782518 数据手册

Document Number: IMX53IEC

Rev. 7, 05/2015

Freescale Semiconductor

Data Sheet: Technical Data

MCIMX53xC

i.MX53 Applications

Processors for Industrial

Products

Package Information

Plastic Package

Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch

Silicon Version 2.1

Ordering Information

See Table 1 on page 2

1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Functional Part Differences and Ordering

1 Introduction

Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

The i.MX53 processor features ARM Cortex™-A8

core, which operates at clock speeds as high as

800 MHz. It provides DDR2/LVDDR2-800,

LPDDR2-800, or DDR3-800 DRAM memories.

1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.1. Special Signal Considerations . . . . . . . . . . . . . . . 16

4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 16

4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 16

4.2. Power Supply Requirements and Restrictions . . . 23

4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 26

4.4. Output Buffer Impedance Characteristics . . . . . . 32

4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 36

4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 43

4.7. External Peripheral Interfaces Parameters . . . . . 65

4.8. XTAL Electrical Specifications . . . . . . . . . . . . . . 141

5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 142

5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 142

5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 143

5.3. Power Setup During Boot . . . . . . . . . . . . . . . . . . 144

6. Package Information and Contact Assignments . . . . . 145

6.1. 19x19 mm Package Information . . . . . . . . . . . . . 145

7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170

The flexibility of the i.MX53 architecture allows for its

use in a wide variety of applications. As the heart of the

application chipset, the i.MX53 processor provides all

the interfaces for connecting peripherals, such as

WLAN, Bluetooth™, GPS, hard drive, camera sensors,

and dual displays.

Features of the i.MX53 processor include the following:

•

Applications processor—The i.MX53xD

processors boost the capabilities of high-tier

portable applications by satisfying the ever

increasing MIPS needs of operating systems and

games. Freescale’s Dynamic Voltage and

Frequency Scaling (DVFS) provides significant

power reduction, allowing the device to run at

lower voltage and frequency with sufficient

MIPS for tasks such as audio decode.

12 3 4 5 6 7...173

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