January 2008
74LVT2245, 74LVTH2245
Low Voltage Octal Bidirectional Transceiver with
3-STATE Inputs/Outputs and 25Ω Series Resistors in the
B Port Outputs
Features
General Description
■ Input and output interface capability to systems at
The LVT2245 and LVTH2245 contain eight non-inverting
bidirectional buffers with 3-STATE outputs and are
intended for bus-oriented applications. The Transmit/
Receive (T/R) input determines the direction of data flow
through the bidirectional transceiver. Transmit (active-
HIGH) enables data from A Ports to B Ports; Receive
(active-LOW) enables data from B Ports to A Ports. The
Output Enable input, when HIGH, disables both A and B
Ports by placing them in a high impedance state. The
equivalent 25Ω-series resistor in the B Port helps reduce
output overshoot and undershoot.
5V V
CC
■ Equivalent 25Ω series resistor on B Port outputs
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH2245),
also available without bushold feature (74LVT2245)
■ Live insertion/extraction permitted
■ Power Up/Down high impedance provides glitch-free
bus loading
■ Outputs source/sink –12mA/+12mA on B Port,
–32mA/+64mA on A Port
The LVTH2245 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
■ Latch-up performance exceeds 500mA
■ ESD performance:
– Human-body model > 2000V
– Machine model > 200V
These transceivers are designed for low voltage (3.3V)
V
applications, but with the capability to provide a TTL
CC
– Charged-device model > 1000V
interface to a 5V environment. The LVT2245 and
LVTH2245 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining low power dissipation.
Ordering Information
Package
Order Number Number
Package Description
74LVT2245WM
74LVT2245SJ
74LVT2245MTC
M20B
M20D
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
74LVTH2245WM
74LVTH2245SJ
74LVTH2245MTC
M20B
M20D
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
©1999 Fairchild Semiconductor Corporation
74LVT2245, 74LVTH2245 Rev. 1.5.0
www.fairchildsemi.com