January 2008
74LVT240, 74LVTH240
Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs
Features
General Description
■ Input and output interface capability to systems at
The LVT240 and LVTH240 are inverting octal buffers
and line drivers designed to be employed as memory
address drivers, clock drivers and bus oriented transmit-
ters or receivers which provides improved PC board
density.
5V V
CC
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH240),
also available without bushold feature (74LVT240)
■ Live insertion/extraction permitted
The LVTH240 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
■ Power Up/Down high impedance provides glitch-free
bus loading
■ Outputs source/sink –32mA/+64mA
■ Functionally compatible with the 74 series 240
■ Latch-up performance exceeds 500mA
■ ESD performance:
These octal buffers and line drivers are designed for low-
voltage (3.3V) V applications, but with the capability to
CC
provide a TTL interface to a 5V environment. The LVT240
and LVTH240 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining low power dissipation.
– Human-body model > 2000V
– Machine model > 200V
– Charged-device model > 1000V
Ordering Information
Package
Order Number Number
Package Description
74LVT240WM
74LVT240SJ
M20B
M20D
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVT240MSA
74LVT240MTC
MSA20
MTC20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
74LVTH240WM
74LVTH240SJ
M20B
M20D
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVTH240MSA
74LVTH240MTC
MSA20
MTC20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
©1999 Fairchild Semiconductor Corporation
74LVT240, 74LVTH240 Rev. 1.5.0
www.fairchildsemi.com