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74LVT240_08 PDF预览

74LVT240_08

更新时间: 2024-11-06 04:47:55
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 驱动器
页数 文件大小 规格书
10页 322K
描述
Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs

74LVT240_08 数据手册

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January 2008  
74LVT240, 74LVTH240  
Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs  
Features  
General Description  
Input and output interface capability to systems at  
The LVT240 and LVTH240 are inverting octal buffers  
and line drivers designed to be employed as memory  
address drivers, clock drivers and bus oriented transmit-  
ters or receivers which provides improved PC board  
density.  
5V V  
CC  
Bushold data inputs eliminate the need for external  
pull-up resistors to hold unused inputs (74LVTH240),  
also available without bushold feature (74LVT240)  
Live insertion/extraction permitted  
The LVTH240 data inputs include bushold, eliminating  
the need for external pull-up resistors to hold unused  
inputs.  
Power Up/Down high impedance provides glitch-free  
bus loading  
Outputs source/sink –32mA/+64mA  
Functionally compatible with the 74 series 240  
Latch-up performance exceeds 500mA  
ESD performance:  
These octal buffers and line drivers are designed for low-  
voltage (3.3V) V applications, but with the capability to  
CC  
provide a TTL interface to a 5V environment. The LVT240  
and LVTH240 are fabricated with an advanced BiCMOS  
technology to achieve high speed operation similar to 5V  
ABT while maintaining low power dissipation.  
– Human-body model > 2000V  
– Machine model > 200V  
– Charged-device model > 1000V  
Ordering Information  
Package  
Order Number Number  
Package Description  
74LVT240WM  
74LVT240SJ  
M20B  
M20D  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
74LVT240MSA  
74LVT240MTC  
MSA20  
MTC20  
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
74LVTH240WM  
74LVTH240SJ  
M20B  
M20D  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
74LVTH240MSA  
74LVTH240MTC  
MSA20  
MTC20  
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.  
All packages are lead free per JEDEC: J-STD-020B standard.  
©1999 Fairchild Semiconductor Corporation  
74LVT240, 74LVTH240 Rev. 1.5.0  
www.fairchildsemi.com  

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