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74LVT162245GX PDF预览

74LVT162245GX

更新时间: 2024-11-30 20:04:43
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 信息通信管理逻辑集成电路
页数 文件大小 规格书
9页 90K
描述
Bus Transceiver, LVT Series, 2-Func, 8-Bit, True Output, BICMOS, PBGA54, 5.50 MM, PLASTIC, MO-205, FBGA-54

74LVT162245GX 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:LFBGA, BGA54,6X9,32
针数:54Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.39
控制类型:COMMON CONTROL计数方向:BIDIRECTIONAL
系列:LVTJESD-30 代码:R-PBGA-B54
JESD-609代码:e0长度:8 mm
逻辑集成电路类型:BUS TRANSCEIVER最大I(ol):0.064 A
位数:8功能数量:2
端口数量:2端子数量:54
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE WITH SERIES RESISTOR输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装等效代码:BGA54,6X9,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH包装方法:TAPE AND REEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:3.3 V
Prop。Delay @ Nom-Sup:4 ns传播延迟(tpd):4.6 ns
认证状态:Not Qualified座面最大高度:1.4 mm
子类别:Bus Driver/Transceivers最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:BICMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
翻译:N/A宽度:5.5 mm
Base Number Matches:1

74LVT162245GX 数据手册

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January 1999  
Revised June 2002  
74LVT162245 74LVTH162245  
Low Voltage 16-Bit Transceiver with 3-STATE Outputs  
and 25Series Resistors in A Port Outputs  
General Description  
Features  
Input and output interface capability to systems at  
The LVT162245 and LVTH162245 contains sixteen non-  
inverting bidirectional buffers with 3-STATE outputs and is  
intended for bus oriented applications. The device is byte  
controlled. Each byte has separate control inputs which  
can be shorted together for full 16-bit operation. The T/R  
inputs determine the direction of data flow through the  
device. The OE inputs disable both the A and B ports by  
placing them in a high impedance state.  
5V VCC  
Bushold data inputs eliminate the need for external pull-  
up resistors to hold unused inputs (74LVTH162245),  
also available without bushold feature (74LVT162245).  
Live insertion/extraction permitted  
Power Up/Down high impedance provides glitch-free  
bus loading  
The LVT162245 and LVTH162245 are designed with  
equivalent 25series resistance in both the HIGH and  
LOW states on the A Port outputs. This design reduces line  
noise in applications such as memory address drivers,  
clock drivers, and bus transceivers/transmitters.  
A Port outputs include equivalent series resistance of  
25making external termination resistors unnecessary  
and reducing overshoot and undershoot  
A Port outputs source/sink ±12 mA.  
B Port outputs source/sink 32 mA/+64 mA  
The LVTH162245 data inputs include bushold, eliminating  
the need for external pull-up resistors to hold unused  
inputs.  
Functionally compatible with the 74 series 162245  
Latch-up performance exceeds 500 mA  
ESD performance:  
These non-inverting transceivers are designed for low volt-  
age (3.3V) VCC applications, but with the capability to pro-  
Human-body model > 2000V  
vide a TTL interface to a 5V environment. The LVT162245  
and LVTH162245 are fabricated with an advanced  
BiCMOS technology to achieve high speed operation simi-  
lar to 5V ABT while maintaining a low power dissipation.  
Machine model > 200V  
Charged-device model > 1000V  
Also packaged in plastic Fine Pitch Ball Grid Array  
(FBGA)  
Ordering Code:  
Order Number  
Package Number  
Package Description  
74LVT162245G  
(Note 1)(Note 2)  
BGA54A  
(Preliminary)  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
74LVT162245MEA  
(Note 2)  
MS48A  
MTD48  
BGA54A  
MS48A  
MS48A  
MTD48  
MTD48  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
74LVT162245MTD  
(Note 2)  
74LVTH162245G  
(Note 1)(Note 2)  
74LVTH162245MEA  
74LVTH162245MEX  
74LVTH162245MTD  
74LVTH162245MTX  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
[TUBE]  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
[TAPE and REEL]  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
[TUBE]  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
[TAPE and REEL]  
Note 1: Ordering code “G” indicates Trays.  
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
© 2002 Fairchild Semiconductor Corporation  
DS012446  
www.fairchildsemi.com  

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