Datasheet > 74AUP1G07_11

74AUP1G07_11

更新时间： 2022-09-25 09:47:35

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
18页	115K
描述
Low-power buffer with open-drain output

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中文翻译

获取价格

数据手册

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74AUP1G07_11 数据手册

74AUP1G07

NXP Semiconductors

Low-power buffer with open-drain output

3. Ordering information

Table 1.

Ordering information

Type number

Package

Temperature range Name

Description

Version

74AUP1G07GW

74AUP1G07GM

74AUP1G07GF

74AUP1G07GN

74AUP1G07GS

40 C to +125 C

TSSOP5

plastic thin shrink small outline package; 5 leads;

body width 1.25 mm

SOT353-1

XSON6

plastic extremely thin small outline package; no leads; SOT886

6 terminals; body 1  1.45  0.5 mm

plastic extremely thin small outline package; no leads; SOT891

6 terminals; body 1  1  0.5 mm

extremely thin small outline package; no leads;

6 terminals; body 0.9  1.0  0.35 mm

SOT1115

SOT1202

extremely thin small outline package; no leads;

6 terminals; body 1.0  1.0  0.35 mm

4. Marking

Table 2.

Marking

Type number

Marking code^[1]

74AUP1G07GW

74AUP1G07GM

74AUP1G07GF

74AUP1G07GN

74AUP1G07GS

[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.

5. Functional diagram

GND

mna623

mna624

mna625

Fig 1. Logic symbol

Fig 2. IEC logic symbol

Fig 3. Logic diagram

74AUP1G07

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 5 — 15 November 2011

2 of 18

123 4 5 6 7...18

中文翻译

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74AUP1G07GM-G	NXP	获取价格	暂无描述
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