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74AHCT2G125DC-G PDF预览

74AHCT2G125DC-G

更新时间: 2024-09-18 19:22:43
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
15页 83K
描述
Bus buffer/line driver; 3-state - Description: Dual Buffer/Line Driver with Active LOW Output Enable; TTL Enabled (3-State) ; Logic switching levels: TTL ; Number of pins: 8 ; Output drive capability: +/- 8 mA ; Power dissipation considerations: Low Power ; Propagation delay: 3.4 ns; Voltage: 4.5-5.5 V

74AHCT2G125DC-G 技术参数

Source Url Status Check Date:2013-06-14 00:00:00是否无铅: 含铅
是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:unknown风险等级:5.73
Base Number Matches:1

74AHCT2G125DC-G 数据手册

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74AHC2G125; 74AHCT2G125  
Dual buffer/line driver; 3-state  
Rev. 02 — 22 December 2008  
Product data sheet  
1. General description  
The 74AHC2G125 and 74AHCT2G125 are high-speed Si-gate CMOS devices. They  
provide a dual non-inverting buffer/line driver with 3-state output. The 3-state output is  
controlled by the output enable input (nOE). A HIGH at nOE causes the output to assume  
a high-impedance OFF-state.  
The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V.  
The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.  
2. Features  
I Symmetrical output impedance  
I High noise immunity  
I Low power dissipation  
I Balanced propagation delays  
I Multiple package options  
I ESD protection:  
N HBM JESD22-A114E: exceeds 2000 V  
N MM JESD22-A115-A: exceeds 200 V  
N CDM JESD22-C101C: exceeds 1000 V  
I Specified from 40 °C to +125 °C  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74AHC2G125DP  
74AHCT2G125DP  
74AHC2G125DC  
74AHCT2G125DC  
74AHC2G125GD  
74AHCT2G125GD  
40 °C to +125 °C  
40 °C to +125 °C  
40 °C to +125 °C  
TSSOP8 plastic thin shrink small outline package; 8 leads;  
body width 3 mm; lead length 0.5 mm  
SOT505-2  
VSSOP8 plastic very thin shrink small outline package;  
8 leads; body width 2.3 mm  
SOT765-1  
SOT996-2  
XSON8U plastic extremely thin small outline package; no  
leads; 8 terminals; UTLP based; body 3 × 2 × 0.5  
mm  
 
 
 

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