2N7002T
Philips Semiconductors
N-channel TrenchMOS FET
6. Characteristics
Table 5:
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max Unit
Static characteristics
V(BR)DSS drain-source breakdown
voltage
ID = 250 µA; VGS = 0 V
Tj = 25 °C
60
55
-
-
-
-
V
V
Tj = −55 °C
VGS(th)
gate-source threshold voltage
ID = 1 mA; VDS = VGS; see Figure 9 and 10
Tj = 25 °C
1
2
-
2.5
-
V
V
V
Tj = 150 °C
0.6
-
Tj = −55 °C
-
2.75
IDSS
drain leakage current
gate leakage current
VDS = 48 V; VGS = 0 V
Tj = 25 °C
-
-
-
0.01
-
1
µA
µA
nA
Tj = 150 °C
10
100
IGSS
VGS = ±15 V; VDS = 0 V
VGS = 10 V; ID = 500 mA; see Figure 6 and 8
Tj = 25 °C
10
RDSon
drain-source on-state
resistance
-
-
-
2.8
-
5
Ω
Ω
Ω
Tj = 150 °C
9.25
5.3
VGS = 4.5 V; ID = 75 mA; see Figure 6 and 8
3.8
Dynamic characteristics
gfs
transfer conductance
input capacitance
output capacitance
reverse transfer capacitance
turn-on time
VGS = 10 V; ID = 200 mA; see Figure 11
100
300
25
18
7.5
3
-
mS
pF
pF
pF
ns
Ciss
Coss
Crss
ton
VGS = 0 V; VDS = 10 V; f = 1 MHz; see
Figure 12
-
-
-
-
-
40
30
10
10
12
VDS = 50 V; RL = 250 Ω; VGS = 10 V;
RG = 50 Ω; RGS = 50 Ω
toff
turn-off time
12
ns
Source-drain diode
VSD
trr
source-drain voltage
IS = 300 mA; VGS = 0 V; see Figure 13
-
-
-
0.85 1.5
V
reverse recovery time
recovered charge
IS = 300 mA; dIS/dt = −100 A/µs; VGS = 0 V
30
30
-
-
ns
nC
Qr
2N7002T_1
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 17 November 2005
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