2N5912C
MONOLITHIC DUAL
N-CHANNEL JFET
Linear Systems replaces discontinued Siliconix & National 2N5912C
FEATURES
The 2N5912C are monolithic dual JFETS. The
Improved Direct Replacement for SILICONIX & NATIONAL 2N5912C
monolithic dual chip design reduces parasitics and
gives better performance at very high frequencies while
ensuring extremely tight matching. These devices are
an excellent choice for use as wideband differential
amplifiers in demanding test and measurement
applications. The 2N5912C is a direct replacement for
discontinued Siliconix and National 2N5912C.
LOW NOISE (10KHz)
en~ 4nV/√Hz
gfs ≥ 4000µS
HIGH TRANSCONDUCTANCE (100MHz)
ABSOLUTE MAXIMUM RATINGS 1
@ 25°C (unless otherwise noted)
Maximum Temperatures
Storage Temperature
Operating Junction Temperature
Maximum Power Dissipation
Continuous Power Dissipation (Total)
Maximum Currents
‐65°C to +150°C
‐55°C to +135°C
The hermetically sealed TO-71 is well suited for military
applications.
(See Packaging Information).
500mW
2N5912C Applications:
Gate Current
50mA
Wideband Differential Amps
High-Speed,Temp-Compensated Single-
Ended Input Amps
Maximum Voltages
Gate to Drain
Gate to Source
‐25V
‐25V
High-Speed Comparators
Impedance Converters and vibrations
detectors.
MATCHING CHARACTERISTICS @ 25°C (unless otherwise stated)
SYMBOL
|VGS1 – VGS2
CHARACTERISTIC
Differential Gate to Source Cutoff Voltage
MIN
‐‐
TYP
‐‐
MAX
40
UNITS
mV
CONDITIONS
VDG = 10V, ID = 5mA
|
∆|VGS1 – VGS2 | / ∆T
Differential Gate to Source Cutoff
Voltage Change with Temperature
Gate to Source Saturation Current Ratio
‐‐
‐‐
40
µV/°C
VDG = 10V, ID = 5mA
TA = ‐55°C to +125°C
VDS = 10V, VGS = 0V
IDSS1 / IDSS2
0.95
‐‐
‐‐
‐‐
‐‐
1
20
1
%
nA
%
|IG1 – IG2
|
Differential Gate Current
VDG = 10V, ID = 5mA
TA = +125°C
VDS = 10V, ID = 5mA, f = 1kHz
gfs1 / gfs2
Forward Transconductance Ratio2
0.95
Click To Buy
CMRR
Common Mode Rejection Ratio
‐‐
85
‐‐
dB
VDG = 5V to 10V, ID = 5mA
ELECTRICAL CHARACTERISTICS @ 25°C (unless otherwise noted)
SYMBOL
BVGSS
VGS(off)
VGS(F)
VGS
CHARACTERISTICS
Gate to Source Breakdown Voltage
Gate to Source Cutoff Voltage
Gate to Source Forward Voltage
Gate to Source Voltage
MIN.
‐25
‐1
‐‐
‐0.3
7
TYP.
‐‐
‐‐
0.7
‐‐
MAX.
UNITS
V
CONDITIONS
IG = ‐1µA, VDS = 0V
VDS = 10V, ID = 1nA
IG = 1mA, VDS = 0V
VDG = 10V, IG = 5mA
VDS = 10V, VGS = 0V
VGS = ‐15V, VDS = 0V
VDG = 10V, ID = 5mA
‐5
‐‐
‐4
IDSS
IGSS
Gate to Source Saturation Current3
‐‐
40
‐50
‐50
mA
Gate Leakage Current3
Gate Operating Current
‐‐
‐‐
‐1
‐1
pA
IG
gfs
Forward Transconductance
Output Conductance
4000
4000
‐‐
‐‐
‐‐
‐‐
‐‐
‐‐
‐‐
‐‐
‐‐
‐‐
‐‐
‐‐
‐‐
7
10000
10000
100
150
5
1.2
1
20
µS
VDG = 10V, ID= 5mA
gos
CISS
CRSS
NF
en
Input Capacitance
Reverse Transfer Capacitance
Noise Figure
pF
dB
VDG = 10V, ID = 5mA, f = 1MHz
VDG = 10V, ID = 5mA, f = 10kHz, RG = 100KΩ
VDG = 10V, ID = 5mA, f = 100Hz
Equivalent Input Noise Voltage
nV/√Hz
‐‐
4
10
VDG = 10V, ID = 5mA, f = 10kHz
Notes: 1. Absolute Maximum ratings are limiting values above which serviceability may be impaired 2. Pulse Test: PW ≤ 300µs Duty Cycle ≤ 3%
3. Assumes smaller value in numerator
Available Packages:
TO-71 (Top View)
2N5912C in TO-71
2N5912C available as bare die
Please contact Micross for full package and die dimensions:
Email: chipcomponents@micross.com
Web: www.micross.com/distribution.aspx
Information furnished by Linear Integrated Systems and Micross Components is believed to be accurate and reliable. However, no responsibility is assumed for its use; nor for any infringement of patents or
other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Linear Integrated Systems.
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