Datasheet > 27LV64

27LV64

更新时间： 2024-09-18 22:30:55

品牌	Logo	应用领域
美国微芯 - MICROCHIP		可编程只读存储器电动程控只读存储器
页数	文件大小	规格书
12页	65K
描述
64K (8K x 8) Low-Voltage CMOS EPROM

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27LV64 数据手册

27LV64

64K (8K x 8) Low-Voltage CMOS EPROM

FEATURES

PACKAGE TYPES

DIP/SOIC

• Wide voltage range 3.0V to 5.5V

• High speed performance

V_PP• 1

28 V_CC

27 PGM

26 NC

25 A8

24 A9

23 A11

22 OE

21 A10

20 CE

19 O7

18 O6

17 O5

16 O4

15 O3

- 200 ns access time available at 3.0V

• CMOS Technology for low power consumption

- 8 mA active current at 3.0V

A12

- 20 mA active current at 5.5V

- 100 µA standby current

• Factory programming available

• Auto-insertion-compatible plastic packages

• Auto ID aids automated programming

• Separate chip enable and output enable controls

• High speed “express” programming algorithm

• Organized 8K x 8: JEDEC standard pinouts

- 28-pin Dual-in-line package

V_SS14

PLCC

- 32-pin PLCC Package

- 28-pin SOIC package

- Tape and reel

A11

A10

• Available for the following temperature ranges:

- Commercial:

- Industrial:

0˚C to +70˚C

-40˚C to +85˚C

DESCRIPTION

The Microchip Technology Inc. 27LV64 is a low-voltage

(3.0 volt) CMOS EPROM designed for battery powered

applications. The device is organized as 8K x 8 (8K-

Byte) non-volatile memory product. The 27LV64 con-

sumes only 8mA maximum of active current during a

3.0 volt read operation therefore improving battery per-

formance. This device is designed for very low voltage

applications where conventional 5.0 volt only EPROMs

can not be used. Accessing individual bytes from an

address transition or from power-up (chip enable pin

going low) is accomplished in less than 200 ns at

3.0V.This device allows system designers the ability to

use low voltage non-volatile memory with today’s low

voltage microprocessors and peripherals in battery

powered applications.

A complete family of packages is offered to provide the

most ﬂexibility in applications. For surface mount appli-

cations, PLCC or SOIC packaging is available. Tape

and reel packaging is also available for PLCC or SOIC

packages.

1996 Microchip Technology Inc.

DS11024E-page 1

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