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1P1G66QDCKRQ1 PDF预览

1P1G66QDCKRQ1

更新时间: 2024-09-14 21:16:19
品牌 Logo 应用领域
德州仪器 - TI 光电二极管
页数 文件大小 规格书
14页 303K
描述
IC 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO5, PLASTIC, SC-70, 5 PIN, Multiplexer or Switch

1P1G66QDCKRQ1 技术参数

生命周期:Obsolete零件包装代码:SOIC
包装说明:TSSOP, TSSOP5/6,.08针数:5
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.59模拟集成电路 - 其他类型:SPST
JESD-30 代码:R-PDSO-G5长度:2 mm
正常位置:NO信道数量:1
功能数量:1端子数量:5
标称断态隔离度:42 dB最大通态电阻 (Ron):30 Ω
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP5/6,.08封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH电源:1.8/5 V
认证状态:Not Qualified筛选级别:AEC-Q100
座面最大高度:1.1 mm子类别:Multiplexer or Switches
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):1.65 V
标称供电电压 (Vsup):2.3 V表面贴装:YES
最长断开时间:8.9 ns最长接通时间:9.5 ns
技术:CMOS温度等级:AUTOMOTIVE
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL宽度:1.25 mm
Base Number Matches:1

1P1G66QDCKRQ1 数据手册

 浏览型号1P1G66QDCKRQ1的Datasheet PDF文件第2页浏览型号1P1G66QDCKRQ1的Datasheet PDF文件第3页浏览型号1P1G66QDCKRQ1的Datasheet PDF文件第4页浏览型号1P1G66QDCKRQ1的Datasheet PDF文件第5页浏览型号1P1G66QDCKRQ1的Datasheet PDF文件第6页浏览型号1P1G66QDCKRQ1的Datasheet PDF文件第7页 
ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈ ꢉꢉ ꢊꢋ ꢇ  
ꢀꢌ ꢁꢈ ꢄ ꢍ ꢎꢌ ꢄꢏꢐ ꢍꢑꢏꢄ ꢏꢁꢏ ꢄꢒ ꢈ ꢀ ꢓꢌ ꢐꢆ ꢔ  
SCES499D − OCTOBER 2003 − REVISED JANUARY 2008  
DBV or DCK PACKAGE  
(TOP VIEW)  
D
D
D
D
D
D
Qualified for Automotive Applications  
1.65-V to 5.5-V V Operation  
CC  
Inputs Accept Voltages to 5.5 V  
High On-Off Output Voltage Ratio  
High Degree of Linearity  
1
2
3
5
4
A
B
GND  
V
CC  
C
High Speed, Typically 0.5 ns  
(V  
= 3 V, C = 50 pF)  
CC  
L
D
D
Low On-State Resistance, Typically 5.5 Ω  
(V = 4.5 V)  
CC  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
description/ordering information  
This single analog switch is designed for 1.65-V to 5.5-V V  
operation.  
CC  
The SN74LVC1G66 can handle both analog and digital signals. The device permits signals with amplitudes of  
up to 5.5 V (peak) to be transmitted in either direction.  
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for  
analog-to-digital and digital-to-analog conversion systems.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
§
SOT (SOT-23) − DBV  
SOT (SOT-70) − DCK  
Reel of 3000  
Reel of 3000  
1P1G66QDBVRQ1  
1P1G66QDCKRQ1  
C66_  
−40°C to 125°C  
C6_  
For the most current package and ordering information, see the Package Option Addendum at the end of this document,  
or see the TI web site at http://www.ti.com.  
§
Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.  
The actual top-side marking has one additional character that designates the wafer fab/assembly site.  
FUNCTION TABLE  
CONTROL  
INPUT  
(C)  
SWITCH  
L
OFF  
ON  
H
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range  
from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage  
because very small parametric changes could cause the device not to meet its published specifications.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢐꢣ  
Copyright 2008, Texas Instruments Incorporated  
ꢟ ꢣ ꢠ ꢟꢘ ꢙꢭ ꢛꢚ ꢞ ꢦꢦ ꢤꢞ ꢜ ꢞ ꢝ ꢣ ꢟ ꢣ ꢜ ꢠ ꢨ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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