1PGSMA4740 - 1PGSMA200Z
Taiwan Semiconductor
1W, 10V - 200V Surface Mount Silicon Zener Diode
FEATURES
KEY PARAMETERS
● Photo Glass passivated junction
● Ideal for automated placement
● Low inductance
PARAMETER
VALUE UNIT
VZ
10 - 200
1.2 - 25
1
V
mA
W
Test current IZT
Ptot
● Typical IR less than 1μA above 11V
● Compliant to RoHS Directive 2011/65/EU and in accordance to
WEEE 2002/96/EC
TJ MAX
175
°C
● Halogen-free according to IEC 61249-2-21
Package
Configuration
DO-214AC (SMA)
Single die
APPLICATIONS
● For general purpose regulation and protection applications
MECHANICAL DATA
● Case: DO-214AC (SMA)
● Molding compound meets UL 94V-0 flammability rating
● Part no. with suffix “H” means AEC-Q101 qualified
● Packing code with suffix "G" means green compound
(halogen-free)
● Moisture sensitivity level: level 1, per J-STD-020
● Terminal: Matte tin plated leads, solderable per J-STD-002
● Meet JESD 201 class 2 whisker test
● Polarity: As marked
DO-214AC (SMA)
● Weight: 0.06g (approximately)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL
VALUE
1.2
UNIT
V
Forward voltage @ IF=200mA
Total power dissipation at TA=50°C, derate above 50°C(1)
Total power dissipation at TA=75°C
Junction temperature
VF
Ptot
Ptot
TJ
1.25
W
1
W
-55 to +175
-55 to +175
°C
Storage temperature
TSTG
°C
Note:
1. Mounted on 5mm x 5mm Cu pad test board
THERMAL PERFORMANCE
PARAMETER
Junction-to-lead thermal resistance per diode
Junction-to-ambient thermal resistance per diode
Junction-to-case thermal resistance per diode
SYMBOL
RӨJL
LIMIT
29
UNIT
°C/W
°C/W
°C/W
RӨJA
120
31
RӨJC
Thermal Performance Note: Units mounted on recommended PCB (5mm x 5mm Cu pad test board)
1
Version:A1707