Datasheet > 1PGSMA130Z

1PGSMA130Z

更新时间： 2024-11-20 00:39:39

品牌	Logo	应用领域
TSC		/
页数	文件大小	规格书
6页	350K
描述
1W, 10V - 200V Surface Mount Silicon Zener Diode

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中文翻译

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数据手册

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1PGSMA130Z 数据手册

1PGSMA4740 - 1PGSMA200Z

Taiwan Semiconductor

1W, 10V - 200V Surface Mount Silicon Zener Diode

FEATURES

KEY PARAMETERS

● Photo Glass passivated junction

● Ideal for automated placement

● Low inductance

PARAMETER

VALUE UNIT

V_Z

10 - 200

1.2 - 25

Test current I_ZT

P_tot

● Typical IR less than 1μA above 11V

● Compliant to RoHS Directive 2011/65/EU and in accordance to

WEEE 2002/96/EC

T_{J MAX}

175

°C

● Halogen-free according to IEC 61249-2-21

Package

Configuration

DO-214AC (SMA)

Single die

APPLICATIONS

● For general purpose regulation and protection applications

MECHANICAL DATA

● Case: DO-214AC (SMA)

● Molding compound meets UL 94V-0 flammability rating

● Part no. with suffix “H” means AEC-Q101 qualified

● Packing code with suffix "G" means green compound

(halogen-free)

● Moisture sensitivity level: level 1, per J-STD-020

● Terminal: Matte tin plated leads, solderable per J-STD-002

● Meet JESD 201 class 2 whisker test

● Polarity: As marked

DO-214AC (SMA)

● Weight: 0.06g (approximately)

ABSOLUTE MAXIMUM RATINGS (T_A= 25°C unless otherwise noted)

PARAMETER

SYMBOL

VALUE

1.2

UNIT

Forward voltage @ I_F=200mA

Total power dissipation at T_A=50°C, derate above 50°C⁽¹⁾

Total power dissipation at T_A=75°C

Junction temperature

V_F

P_tot

T_J

1.25

-55 to +175

°C

Storage temperature

T_STG

°C

Note:

1. Mounted on 5mm x 5mm Cu pad test board

THERMAL PERFORMANCE

PARAMETER

Junction-to-lead thermal resistance per diode

Junction-to-ambient thermal resistance per diode

Junction-to-case thermal resistance per diode

SYMBOL

R_ӨJL

LIMIT

UNIT

°C/W

R_ӨJA

120

R_ӨJC

Thermal Performance Note: Units mounted on recommended PCB (5mm x 5mm Cu pad test board)

Version:A1707

12 3 4 5 6

中文翻译

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