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1N5186_08 PDF预览

1N5186_08

更新时间: 2024-11-23 12:50:07
品牌 Logo 应用领域
美高森美 - MICROSEMI 整流二极管快速恢复二极管
页数 文件大小 规格书
2页 106K
描述
VOIDLESS-HERMETICALLY SEALED FAST RECOVERY GLASS RECTIFIERS

1N5186_08 数据手册

 浏览型号1N5186_08的Datasheet PDF文件第2页 
1N5186 thru 1N5190  
VOIDLESS-HERMETICALLY SEALED  
FAST RECOVERY GLASS RECTIFIERS  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
This “fast recovery” rectifier diode series is military qualified to MIL-PRF-19500/424  
and is ideal for high-reliability applications where a failure cannot be tolerated.  
These industry-recognized 3.0 Amp rated rectifiers for working peak reverse  
voltages from 100 to 600 volts are hermetically sealed with voidless-glass  
construction using an internal “Category I” metallurgical bond. These devices are  
also available in surface mount MELF package configurations by adding a “US”  
suffix. Microsemi also offers numerous other rectifier products to meet higher and  
lower current ratings with various recovery time speed requirements including fast  
and ultrafast device types in both through-hole and surface mount packages.  
Package E  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Popular JEDEC registered 1N5186 to 1N5190 series  
Voidless hermetically sealed glass package  
Triple-Layer Passivation  
Fast recovery 3 Amp rectifiers 100 to 600 V  
Military and other high-reliability applications  
General rectifier applications including bridges,  
half-bridges, catch diodes, etc.  
High forward surge current capability  
Extremely robust construction  
Internal “Category I” Metallurgical bonds  
Working Peak Reverse Voltage 100 to 600 Volts.  
JAN, JANTX, and JANTXV available per MIL-PRF-  
19500/424  
Low thermal resistance  
Controlled avalanche with peak reverse power  
capability  
Surface mount equivalents also available in a square  
end-cap MELF configuration with “US” suffix  
Inherently radiation hard as described in Microsemi  
MicroNote 050  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Junction & Storage Temperature: -65oC to +175oC  
CASE: Hermetically sealed voidless hard glass  
with Tungsten slugs  
Thermal Resistance: 20oC/W junction to lead at 3/8  
inch (10 mm) lead length from body  
Thermal Impedance: 1.5oC/W @ 10 ms heating time  
TERMINATIONS: Axial-leads are Tin/Lead  
(Sn/Pb) over Copper  
MARKING: Body paint and part number, etc.  
POLARITY: Cathode band  
Average Rectified Forward Current (IO): 3.0 Amps @ TA  
= 25ºC and 0.700 Amps at TA = 150ºC  
TAPE & REEL option: Standard per EIA-296  
WEIGHT: 750 mg  
Forward Surge Current: 80 Amps @ 8.3 ms half-sine  
Solder Temperatures: 260ºC for 10 s (maximum)  
See package dimensions on last page  
ELECTRICAL CHARACTERISTICS  
WORKING PEAK  
REVERSE  
MINIMUM  
BREAKDOWN  
VOLTAGE  
FORWARD  
VOLTAGE  
MAXIMUM  
REVERSE  
CURRENT  
MAXIMUM  
REVERSE  
RECOVERY  
TIME  
AVERAGE  
RECTIFIED  
CURRENT AMPS  
VOLTAGE  
V
F
V
V
@ 50μA  
I
@ V  
t
I
@ 9A (pulsed)  
TYPE  
RWM  
BR  
R
25oC  
µA  
RWM  
rr  
O
MIN  
MAX  
100oC  
25oC  
AMPS  
3.0  
3.0  
3.0  
150oC  
AMPS  
0.7  
0.7  
0.7  
VOLTS  
100V  
200V  
400V  
500V  
600V  
VOLTS  
VOLTS  
VOLTS  
ns  
150  
200  
250  
300  
400  
µA  
1N5186  
1N5187  
1N5188  
1N5189  
1N5190  
120V  
240V  
480V  
550V  
660V  
0.9V  
1.5V  
2.0  
100  
3.0  
3.0  
0.7  
0.7  
Copyright © 2008  
6-11-2008 REV C  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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