5秒后页面跳转
捷配首页

Datasheet > XQVR300-4CB228Q
XQVR300-4CB228Q PDF预览

XQVR300-4CB228Q

更新时间： 2024-11-07 21:16:15
品牌 Logo 应用领域
赛灵思 - XILINX 栅可编程逻辑
页数 文件大小 规格书
14页 169K
描述
Field Programmable Gate Array, 1536 CLBs, 322970 Gates, 6912-Cell, CMOS, CQFP228, CERAMIC, QFP-228

阅读下载

中文翻译

获取价格

XQVR300-4CB228Q 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：Active零件包装代码：QFP
包装说明：GQFF, TPAK228,2.5SQ,25针数：228
Reach Compliance Code：compliantECCN代码：3A001.A.2.C
HTS代码：8542.39.00.01风险等级：5.22
JESD-30 代码：S-CQFP-F228JESD-609代码：e0
长度：39.37 mm可配置逻辑块数量：1536
等效关口数量：322970输入次数：316
逻辑单元数量：6912输出次数：316
端子数量：228最高工作温度：125 °C
最低工作温度：-55 °C组织：1536 CLBS, 322970 GATES
封装主体材料：CERAMIC, METAL-SEALED COFIRED封装代码：GQFF
封装等效代码：TPAK228,2.5SQ,25封装形状：SQUARE
封装形式：FLATPACK, GUARD RING峰值回流温度（摄氏度）：NOT SPECIFIED
电源：1.2/3.6,2.5 V可编程逻辑类型：FIELD PROGRAMMABLE GATE ARRAY
认证状态：Not Qualified筛选级别：MIL-PRF-38535 Class Q
座面最大高度：3.302 mm子类别：Field Programmable Gate Arrays
最大供电电压：2.625 V最小供电电压：2.375 V
标称供电电压：2.5 V表面贴装：YES
技术：CMOS温度等级：MILITARY
端子面层：TIN LEAD端子形式：FLAT
端子节距：0.635 mm端子位置：QUAD
处于峰值回流温度下的最长时间：NOT SPECIFIED总剂量：100k Rad(Si) V
宽度：39.37 mmBase Number Matches：1

XQVR300-4CB228Q 数据手册

 浏览型号XQVR300-4CB228Q的Datasheet PDF文件第2页浏览型号XQVR300-4CB228Q的Datasheet PDF文件第3页浏览型号XQVR300-4CB228Q的Datasheet PDF文件第4页浏览型号XQVR300-4CB228Q的Datasheet PDF文件第5页浏览型号XQVR300-4CB228Q的Datasheet PDF文件第6页浏览型号XQVR300-4CB228Q的Datasheet PDF文件第7页 
0
R
QPro Virtex 2.5V Radiation  
Hardened FPGAs  
0
2
DS028 (v1.2) November 5, 2001  
Preliminary Product Specification  
-
Complete support for Unified Libraries, Relationally  
Placed Macros, and Design Manager  
Features  
•
•
•
0.22 µm 5-layer epitaxial process  
-
Wide selection of PC and workstation platforms  
QML certified  
•
•
SRAM-based in-system configuration  
Radiation hardened FPGAs for space and satellite  
applications  
-
-
Unlimited reprogrammability  
Four programming modes  
•
•
•
Guaranteed total ionizing dose to 100K Rad(si)  
Available to Standard Microcircuit Drawings. Contact  
Defense Supply Center Columbus (DSCC) for more  
information at http://www.dscc.dla.mil  
2
Latch-up immune to LET = 125 MeV cm /mg  
SEU immunity achievable with recommended  
redundancy implementation  
-
-
-
5962-99572 for XQVR300  
5962-99573 for XQVR600  
5962-99574 for XQVR1000  
•
•
Guaranteed over the full military temperature range  
(–55°C to +125°C)  
Fast, high-density Field-Programmable Gate Arrays  
-
-
-
Densities from 100k to 1M system gates  
System performance up to 200 MHz  
Hot-swappable for Compact PCI  
Description  
The QPro™ Virtex™ FPGA family delivers high-perfor-  
mance, high-capacity programmable logic solutions. Dra-  
matic increases in silicon efficiency result from optimizing  
the new architecture for place-and-route efficiency and  
exploiting an aggressive 5-layer-metal 0.22 µm CMOS pro-  
cess. These advances make QPro Virtex FPGAs powerful  
and flexible alternatives to mask-programmed gate arrays.  
The Virtex radiation hardened family comprises the three  
members shown in Table 1.  
•
•
Multi-standard SelectI/O™ interfaces  
-
-
16 high-performance interface standards  
Connects directly to ZBTRAM devices  
Built-in clock-management circuitry  
-
Four dedicated delay-locked loops (DLLs) for  
advanced clock control  
-
Four primary low-skew global clock distribution  
nets, plus 24 secondary global nets  
Building on experience gained from previous generations of  
FPGAs, the Virtex family represents a revolutionary step  
forward in programmable logic design. Combining a wide  
variety of programmable system features, a rich hierarchy of  
fast, flexible interconnect resources, and advanced process  
technology, the QPro Virtex family delivers a high-speed  
and high-capacity programmable logic solution that  
enhances design flexibility while reducing time-to-market.  
•
•
Hierarchical memory system  
-
-
-
LUTs configurable as 16-bit RAM, 32-bit RAM,  
16-bit dual-ported RAM, or 16-bit Shift Register  
Configurable synchronous dual-ported 4k-bit  
RAMs  
Fast interfaces to external high-performance RAMs  
Refer to the “Virtex™ 2.5V Field Programmable Gate  
Arrays” commercial data sheet for more information on  
device architecture and timing specifications.  
Flexible architecture that balances speed and density  
-
-
-
-
Dedicated carry logic for high-speed arithmetic  
Dedicated multiplier support  
Cascade chain for wide-input functions  
Abundant registers/latches with clock enable, and  
dual synchronous/asynchronous set and reset  
-
-
-
Internal 3-state bussing  
IEEE 1149.1 boundary-scan logic  
Die-temperature sensing device  
•
Supported by FPGA Foundation™ and Alliance  
Development Systems  
© 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.  
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.  
DS028 (v1.2) November 5, 2001  
www.xilinx.com  
1
Preliminary Product Specification  
1-800-255-7778  
1234567...14

中文翻译

下载PDF

与XQVR300-4CB228Q相关器件

型号 品牌 获取价格 描述 数据表
XQVR300-4CB228V XILINX

获取价格

 		QPro Virtex 2.5V Radiation Hardened FPGAs
XQVR300-4CBG228V XILINX

获取价格

 		Field Programmable Gate Array, 1536 CLBs, 322970 Gates, CMOS, CQFP228, CERAMIC, QFP-228
XQVR600 XILINX

获取价格

 		QPro Virtex 2.5V Radiation Hardened FPGAs
XQVR600-4CB228M XILINX

获取价格

 		QPro Virtex 2.5V Radiation Hardened FPGAs
XQVR600-4CB228Q XILINX

获取价格

 		Field Programmable Gate Array, 3456 CLBs, 661111 Gates, 15552-Cell, CMOS, CQFP228, CERAMIC
XQVR600-4CB228V XILINX

获取价格

 		QPro Virtex 2.5V Radiation Hardened FPGAs
XQVR600-4CBG228M XILINX

获取价格

 		Field Programmable Gate Array, 3456 CLBs, 661111 Gates, CMOS, CQFP228, CERAMIC, QFP-228
XQZU11EG-1FFRB1156I XILINX

获取价格

 		Micro Peripheral IC,
XQZU11EG-1FFRB1156M XILINX

获取价格

 		Micro Peripheral IC,
XQZU11EG-2FFRB1156I XILINX

获取价格

 		Micro Peripheral IC,

与XQVR300-4CB228Q相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证