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Virtex-II 1.5V
Field-Programmable Gate Arrays
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DS031-1 (v1.5) April 2, 2001
Advance Product Specification
®
Summary of Virtex -II Features
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Industry First Platform FPGA Solution
IP-Immersion™ Architecture
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XCITE™ Digitally Controlled Impedance (DCI) I/O:
on-chip termination resistors for single-ended I/O
standards
PCI-X @ 133 MHz, PCI @ 66 MHz and 33 MHz
compliance
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Densities from 40K to 10M system gates
420 MHz internal clock speed (Advance Data)
840+ Mb/s I/O (Advance Data)
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Differential Signaling
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SelectRAM™ Memory Hierarchy
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840 Mb/s Low-Voltage Differential Signaling I/O
(LVDS) with current mode drivers
Bus LVDS I/O
Lightning Data Transport (LDT) I/O with current
driver buffers
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3.5 Mb of True Dual-Port™ RAM in 18-Kbit block
SelectRAM resources
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Up to 1.9 Mb of distributed SelectRAM resources
High-performance interfaces to external memory
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400 Mb/s DDR-SDRAM interface (Advance Data)
400 Mb/s FCRAM interface (Advance Data)
333 Mb/s QDR™-SRAM interface (Advance
Data)
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Low-Voltage Positive Emitter-Coupled Logic
(LVPECL) I/O
Built-in DDR Input and Output registers
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Proprietary high-performance SelectLink™
Technology
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600 Mb/s Sigma RAM interface (Advance Data)
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Arithmetic Functions
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High-bandwidth data path
Double Data Rate (DDR) link
Web-based HDL generation methodology
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Dedicated 18-bit x 18-bit multiplier blocks
Fast look-ahead carry logic chains
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Supported by Xilinx Foundation™ and Alliance™
Series Development Systems
Flexible Logic Resources
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Up to 122,880 internal registers / latches with
Clock Enable
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Integrated VHDL and Verilog design flows
Compilation of 10M system gates designs
Internet Team Design (ITD) tool
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Up to 122,880 look-up tables (LUTs) or cascadable
16-bit shift registers
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Wide multiplexers and wide-input function support
Horizontal cascade chain and Sum-of-Products
support
SRAM-Based In-System Configuration
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Fast SelectMAP™ configuration
Triple Data Encryption Standard (DES) security
option (Bitstream Encryption)
IEEE1532 support
Partial reconfiguration
Unlimited re-programmability
Readback capability
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Internal 3-state bussing
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High-Performance Clock Management Circuitry
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Up to 12 DCM (Digital Clock Manager) modules
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Precise clock de-skew
Flexible frequency synthesis
High-resolution phase shifting
EMI reduction
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Power-Down Mode
0.15 µm 8-Layer Metal process with 0.12 µm
high-speed transistors
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16 global clock multiplexer buffers
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Active Interconnect™ Technology
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1.5 V (VCCINT) core power supply, dedicated 3.3 V
VCCAUX auxiliary and VCCO I/O power supplies
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Fourth generation segmented routing structure
Predictable, fast routing delay, independent of
fanout
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IEEE 1149.1 compatible boundary-scan logic support
Flip-Chip and Wire-Bond Ball Grid Array (BGA)
packages in three standard fine pitches (0.80mm,
1.00mm, and 1.27mm)
SelectI/O-Ultra™ Technology
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Up to 1,108 user I/Os
19 single-ended standards and six differential
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100% factory tested
standards
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Programmable sink current (2 mA to 24 mA) per
I/O
© 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS031-1 (v1.5) April 2, 2001
Advance Product Specification
www.xilinx.com
1-800-255-7778
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