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XC2V1000-4FG456I

更新时间: 2024-11-07 21:54:51
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赛灵思 - XILINX /
页数 文件大小 规格书
311页 1765K
描述
Virtex-II Platform FPGAs: Complete Data Sheet

XC2V1000-4FG456I 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456针数:456
Reach Compliance Code:not_compliantECCN代码:3A991.D
HTS代码:8542.39.00.01风险等级:8.72
最大时钟频率:650 MHzCLB-Max的组合延迟:0.44 ns
JESD-30 代码:S-PBGA-B456JESD-609代码:e0
长度:23 mm湿度敏感等级:3
可配置逻辑块数量:1280等效关口数量:1000000
输入次数:324逻辑单元数量:11520
输出次数:324端子数量:456
组织:1280 CLBS, 1000000 GATES封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA456,22X22,40
封装形状:SQUARE封装形式:GRID ARRAY
峰值回流温度(摄氏度):225电源:1.5,1.5/3.3,3.3 V
可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY认证状态:Not Qualified
座面最大高度:2.6 mm子类别:Field Programmable Gate Arrays
最大供电电压:1.575 V最小供电电压:1.425 V
标称供电电压:1.5 V表面贴装:YES
技术:CMOS端子面层:Tin/Lead (Sn63Pb37)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
宽度:23 mmBase Number Matches:1

XC2V1000-4FG456I 数据手册

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Virtex™-II Platform FPGAs:  
Complete Data Sheet  
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DS031 August 1, 2003  
Product Specification  
This document includes all four modules of the Virtex-II Platform FPGA data sheet.  
Module 1:  
Introduction and Overview  
Module 3:  
DC and Switching Characteristics  
DS031-1 (v2.0) August 1, 2003  
7 pages  
DS031-3 (v3.0) August 1, 2003  
38 pages  
Summary of Features  
Electrical Characteristics  
General Description  
Device/Package Combinations and Maximum I/O  
Ordering Information  
Performance Characteristics  
Switching Characteristics  
Pin-to-Pin Output Parameter Guidelines  
Pin-to-Pin Input Parameter Guidelines  
DCM Timing Parameters  
Module 2:  
Functional Description  
DS031-2 (v3.0) August 1, 2003  
40 pages  
Module 4:  
Pinout Information  
Detailed Description  
DS031-4 (v2.0) August 1, 2003  
225 pages  
Digitally Controlled Impedance (DCI)  
Configurable Logic Blocks (CLBs)  
Sum of Products  
Pin Definitions  
Pinout Tables  
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CS144 Chip-Scale BGA Package  
3-State Buffers  
FG256 Fine-Pitch BGA Package  
FG456 Fine-Pitch BGA Package  
FG676 Fine-Pitch BGA Package  
BG575 Standard BGA Package  
18-Kb Block SelectRAM™ Resources  
18-Bit x 18-Bit Multipliers  
Global Clock Multiplexer Buffers  
Digital Clock Manager (DCM)  
Active Interconnect Technology  
Creating a Design  
BG728 Standard BGA Package  
FF896 Flip-Chip Fine-Pitch BGA Package  
FF1152 Flip-Chip Fine-Pitch BGA Package  
FF1517 Flip-Chip Fine-Pitch BGA Package  
BF957Flip-Chip BGA Package  
Configuration  
IMPORTANT NOTE: The Virtex-II Platform FPGA data sheet is created and published in separate modules. This complete  
version is provided for easy downloading and searching of the complete document. Page, figure, and table numbers begin  
at 1 for each module, and each module has its own Revision History at the end. Use the PDF "Bookmarks" pane for easy  
navigation in this volume.  
© 2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.  
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.  
DS031 August 1, 2003  
www.xilinx.com  
Product Specification  
1-800-255-7778  

XC2V1000-4FG456I 替代型号

型号 品牌 替代类型 描述 数据表
XC2V1000-4FGG456I XILINX

完全替代

Field Programmable Gate Array, 1280 CLBs, 1000000 Gates, 650MHz, 11520-Cell, CMOS, PBGA456

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