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WS512K32NBV-17G2MEA PDF预览

WS512K32NBV-17G2MEA

更新时间: 2024-02-17 11:15:13
品牌 Logo 应用领域
其他 - ETC 静态存储器
页数 文件大小 规格书
8页 174K
描述
512Kx32 3.3V SRAM MODULE

WS512K32NBV-17G2MEA 技术参数

生命周期:TransferredReach Compliance Code:unknown
风险等级:5.55最长访问时间:17 ns
其他特性:CONFIGURABLE AS 1M X 16 OR 512K X 32JESD-30 代码:S-CQMA-G68
内存密度:16777216 bit内存集成电路类型:SRAM MODULE
内存宽度:8功能数量:1
端子数量:68字数:2097152 words
字数代码:2000000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:2MX8封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:SQUARE封装形式:MICROELECTRONIC ASSEMBLY
并行/串行:PARALLEL认证状态:Not Qualified
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:BICMOS温度等级:MILITARY
端子形式:GULL WING端子位置:QUAD
Base Number Matches:1

WS512K32NBV-17G2MEA 数据手册

 浏览型号WS512K32NBV-17G2MEA的Datasheet PDF文件第2页浏览型号WS512K32NBV-17G2MEA的Datasheet PDF文件第3页浏览型号WS512K32NBV-17G2MEA的Datasheet PDF文件第4页浏览型号WS512K32NBV-17G2MEA的Datasheet PDF文件第5页浏览型号WS512K32NBV-17G2MEA的Datasheet PDF文件第6页浏览型号WS512K32NBV-17G2MEA的Datasheet PDF文件第7页 
WS512K32BV-XXXE  
512Kx32 3.3V SRAM MODULE PRELIMINARY*  
FEATURES  
Access Times of 15, 17, 20ns  
MIL-STD-883 Compliant Devices Available  
Low Voltage Operation  
Commercial, Industrial and Military Temperature Ranges  
3.3 Volt Power Supply  
BiCMOS  
TTL Compatible Inputs and Outputs  
Packaging  
Built-in Decoupling Caps and Multiple Ground Pins for Low  
• 66-pin, PGA Type, 1.385 inch square Hermetic Ceramic HIP  
(Package 402)  
Noise Operation  
Weight  
• 68 lead, Hermetic CQFP (G2), 22mm (0.880 inch) square  
(Package 500). Designed to fit JEDEC 68 lead 0.990" CQFJ  
footprint  
WS512K32BV-XG2XE - 8 grams typical  
WS512K32NBV-XH2XE - 13 grams typical  
Organized as 512Kx32; User Configurable as 1Mx16 or 2Mx8  
Radiation Tolerant with Epitaxial Layer Die  
*
This data sheet describes a product under development, not fully  
characterized, and is subject to change without notice.  
This speed is Advanced information.  
PIN CONFIGURATION FOR WS512K32NBV-XH2XE  
TOP VIEW  
PIN DESCRIPTION  
1
12  
23  
34  
45  
56  
I/O0-31 Data Inputs/Outputs  
A0-18  
WE1-4  
CS1-4  
OE  
Address Inputs  
Write Enables  
Chip Selects  
Output Enable  
Power Supply  
Ground  
I/O  
I/O  
8
9
WE  
2
I/O15  
I/O14  
I/O13  
I/O12  
OE  
I/O24  
I/O25  
I/O26  
V
CC  
I/O31  
I/O30  
I/O29  
I/O28  
CS2  
CS  
4
I/O10  
GND  
I/O11  
WE  
4
VCC  
A
A
A
A
A
13  
14  
15  
16  
17  
A
A
6
7
I/O27  
GND  
NC  
A10  
A11  
A12  
VCC  
A
A
3
4
5
3
3
A
A
A
0
1
2
Not Connected  
A18  
NC  
BLOCK DIAGRAM  
WE1  
A
8
9
A
WE1CS1  
WE2CS2  
WE3CS3  
WE4CS4  
I/O  
I/O  
I/O  
I/O  
7
A
WE  
CS  
I/O23  
I/O22  
I/O21  
I/O20  
OE  
0-18  
A
I/O  
I/O  
I/O  
0
1
2
CS  
NC  
I/O  
1
6
I/O16  
I/O17  
I/O18  
512K x 8  
512K x 8  
512K x 8  
512K x 8  
5
4
GND  
I/O19  
3
8
8
8
8
11  
22  
33  
44  
55  
66  
I/O16-23  
I/O24-31  
I/O0-7  
I/O8-15  
February 1998  
1
White Microelectronics • Phoenix, AZ • (602) 437-1520  

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