WS512K32BV-XXXE
White Electronic Designs
*ADVANCED
512Kx32 3.3V SRAM MODULE
FEATURES
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3.3V Power Supply
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Access Times of 15*, 17, 20ns
Low Voltage Operation
Packaging
BiCMOS
TTL Compatible Inputs and Outputs
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Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
• 66-pin, PGA Type, 1.385 inch square Hermetic
Ceramic HIP (Package 402)
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Weight
• 68 lead, Hermetic CQFP (G2), 22mm (0.880
inch) square (Package 500). Designed to fit
JEDEC 68 lead 0.990" CQFJ footprint
• WS512K32BV-XG2XE - 8 grams typical
• WS512K32NBV-XH2XE - 13 grams typical
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Organized as 512Kx32; User Configurable as
1Mx16 or 2Mx8
* This product is under development, is not qualified or characterized and is subject to
change or cancellation without notice.
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Radiation Tolerant with Epitaxial Layer Die
Commercial and Industrial Temperature Ranges
PIN CONFIGURATION FOR WS512K32NBV-XH2XE
TOP VIEW
PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs
1
12
23
34
45
56
A0-18
Address Inputs
I/O
8
9
WE#
2
I/O15
I/O24
I/O25
I/O26
V
CC
I/O31
I/O30
I/O29
I/O28
WE#1-4 Write Enables
CS#1-4 Chip Selects
OE#
VCC
GND
NC
I/O
CS#
2
I/O14
I/O13
I/O12
OE#
CS#
4
4
Output Enable
Power Supply
Ground
I/O10
GND
I/O11
WE#
A13
A14
A15
A16
A17
A
6
7
I/O27
Not Connected
A
A
A
V
10
A
A
A
3
4
5
3
3
A0
A1
A2
11
A18
NC
BLOCK DIAGRAM
12
CC
WE#
1
A
8
9
A
I/O7
I/O6
I/O5
I/O4
A
WE#
CS#
I/O23
I/O22
I/O21
I/O20
WE#1 CS#1
WE#2 CS#2
WE#3 CS#3
WE#4 CS#4
512K x 8
OE#
A0-18
I/O0
I/O1
I/O2
CS#
NC
1
I/O16
I/O17
I/O18
GND
I/O19
512K x 8
512K x 8
512K x 8
I/O3
8
8
8
8
11
22
33
44
55
66
I/O0-7
I/O8-15
I/O16-23
I/O24-31
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
December, 1999
Rev. 2
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com