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W741C260 PDF预览

W741C260

更新时间: 2024-09-16 22:14:39
品牌 Logo 应用领域
华邦 - WINBOND 微控制器和处理器外围集成电路时钟
页数 文件大小 规格书
92页 478K
描述
4-BIT MICROCONTROLLER

W741C260 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:QFP-80
针数:80Reach Compliance Code:not_compliant
HTS代码:8542.31.00.01风险等级:5.92
Is Samacsys:N具有ADC:NO
地址总线宽度:位大小:4
最大时钟频率:4.19 MHzDAC 通道:NO
DMA 通道:NO外部数据总线宽度:
JESD-30 代码:R-PQFP-G80JESD-609代码:e0
I/O 线路数量:20端子数量:80
最高工作温度:70 °C最低工作温度:
PWM 通道:NO封装主体材料:PLASTIC/EPOXY
封装代码:QFP封装等效代码:QFP80(UNSPEC)
封装形状:RECTANGULAR封装形式:FLATPACK
峰值回流温度(摄氏度):NOT SPECIFIED电源:2.2/5.5 V
认证状态:Not QualifiedRAM(字节):64
ROM(单词):2048ROM可编程性:MROM
速度:4.19 MHz子类别:Microcontrollers
最大压摆率:4 mA最大供电电压:5.5 V
最小供电电压:2.2 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
uPs/uCs/外围集成电路类型:MICROCONTROLLERBase Number Matches:1

W741C260 数据手册

 浏览型号W741C260的Datasheet PDF文件第2页浏览型号W741C260的Datasheet PDF文件第3页浏览型号W741C260的Datasheet PDF文件第4页浏览型号W741C260的Datasheet PDF文件第5页浏览型号W741C260的Datasheet PDF文件第6页浏览型号W741C260的Datasheet PDF文件第7页 
W741C260  
4-BIT MICROCONTROLLER  
Table of Contents--  
GENERAL DESCRIPTION.........................................................................................................................2  
FEATURES.................................................................................................................................................2  
PIN CONFIGURATION...............................................................................................................................3  
PIN DESCRIPTION.....................................................................................................................................4  
BLOCK DIAGRAM......................................................................................................................................5  
FUNCTIONAL DESCRIPTION ...................................................................................................................6  
ABSOLUTE MAXIMUM RATINGS .............................................................................................................34  
DC CHARACTERISTICS............................................................................................................................35  
AC CHARACTERISTICS............................................................................................................................36  
PAD ASSIGMENT & POSITIONS ..............................................................................................................37  
TYPICAL APPLICATION CIRCUIT.............................................................................................................39  
INSTRUCTION SET TABLE.......................................................................................................................40  
PACKAGE DIMENSION.............................................................................................................................90  
Publication Release Date: March 1998  
- 1 -  
Revision A3  

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