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W741E260 PDF预览

W741E260

更新时间: 2024-11-16 22:14:39
品牌 Logo 应用领域
华邦 - WINBOND 闪存微控制器
页数 文件大小 规格书
94页 546K
描述
4-BIT FLASH MICROCONTROLLER

W741E260 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:QFP-80
针数:80Reach Compliance Code:not_compliant
HTS代码:8542.31.00.01风险等级:5.92
具有ADC:NO地址总线宽度:
位大小:4最大时钟频率:4.19 MHz
DAC 通道:NODMA 通道:NO
外部数据总线宽度:JESD-30 代码:R-PQFP-G80
JESD-609代码:e0I/O 线路数量:20
端子数量:80最高工作温度:70 °C
最低工作温度:PWM 通道:NO
封装主体材料:PLASTIC/EPOXY封装代码:QFP
封装等效代码:QFP80,.75X1,32封装形状:RECTANGULAR
封装形式:FLATPACK峰值回流温度(摄氏度):NOT SPECIFIED
电源:3/5 V认证状态:Not Qualified
RAM(字节):64ROM(单词):2048
ROM可编程性:FLASH速度:4.19 MHz
子类别:Microcontrollers最大压摆率:4 mA
最大供电电压:5.5 V最小供电电压:2.4 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.8 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
uPs/uCs/外围集成电路类型:MICROCONTROLLERBase Number Matches:1

W741E260 数据手册

 浏览型号W741E260的Datasheet PDF文件第2页浏览型号W741E260的Datasheet PDF文件第3页浏览型号W741E260的Datasheet PDF文件第4页浏览型号W741E260的Datasheet PDF文件第5页浏览型号W741E260的Datasheet PDF文件第6页浏览型号W741E260的Datasheet PDF文件第7页 
W741E260  
4-BIT FLASH MICROCONTROLLER  
Table of Contents--  
GENERAL DESCRIPTION..............................................................................................................................2  
FEATURES......................................................................................................................................................2  
PIN CONFIGURATION....................................................................................................................................4  
PIN DESCRIPTION .........................................................................................................................................5  
BLOCK DIAGRAM...........................................................................................................................................6  
FUNCTIONAL DESCRIPTION ........................................................................................................................7  
ABSOLUTE MAXIMUM RATINGS ................................................................................................................37  
DC CHARACTERISTICS...............................................................................................................................37  
AC CHARACTERISTICS...............................................................................................................................39  
PAD ASSIGNMENT AND POSITIONS..........................................................................................................39  
TYPICAL APPLICATION CIRCUIT................................................................................................................41  
INSTRUCTION SET TABLE..........................................................................................................................42  
PACKAGE DIMENSIONS..............................................................................................................................93  
Publication Release Date: March 1998  
- 1 -  
Revision A2  

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