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W741L250 PDF预览

W741L250

更新时间: 2024-11-19 22:14:39
品牌 Logo 应用领域
华邦 - WINBOND 微控制器和处理器外围集成电路时钟
页数 文件大小 规格书
86页 469K
描述
4-BIT MICROCONTROLLER

W741L250 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:14 X 20 MM, QFP-64
针数:64Reach Compliance Code:not_compliant
HTS代码:8542.31.00.01风险等级:5.92
具有ADC:NO地址总线宽度:
位大小:4最大时钟频率:1 MHz
DAC 通道:NODMA 通道:NO
外部数据总线宽度:JESD-30 代码:R-PQFP-G64
JESD-609代码:e0I/O 线路数量:20
端子数量:64最高工作温度:70 °C
最低工作温度:PWM 通道:NO
封装主体材料:PLASTIC/EPOXY封装代码:QFP
封装等效代码:QFP64,.7X.95,40封装形状:RECTANGULAR
封装形式:FLATPACK峰值回流温度(摄氏度):NOT SPECIFIED
电源:1.5 V认证状态:Not Qualified
RAM(字节):64ROM(单词):2048
ROM可编程性:MROM速度:1 MHz
子类别:Microcontrollers最大压摆率:0.065 mA
最大供电电压:1.8 V最小供电电压:1.2 V
标称供电电压:1.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:1 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIEDuPs/uCs/外围集成电路类型:MICROCONTROLLER
Base Number Matches:1

W741L250 数据手册

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W741L250  
4-BIT MICROCONTROLLER  
Table of Contents--  
GENERAL DESCRIPTION..............................................................................................................................2  
FEATURES......................................................................................................................................................2  
PIN CONFIGURATION....................................................................................................................................3  
PIN DESCRIPTION..........................................................................................................................................4  
BLOCK DIAGRAM...........................................................................................................................................5  
FUNCTIONAL DESCRIPTION ........................................................................................................................6  
ABSOLUTE MAXIMUM RATINGS ................................................................................................................31  
DC CHARACTERISTICS...............................................................................................................................32  
AC CHARACTERISTICS...............................................................................................................................33  
PAD ASSIGNMENT & POSITIONS...............................................................................................................33  
TYPICAL APPLICATION CIRCUIT................................................................................................................35  
INSTRUCTION SET TABLE..........................................................................................................................36  
PACKAGE DIMENSION................................................................................................................................84  
Publication Release Date: March 1998  
- 1 -  
Revision A2  

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