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W6691CD PDF预览

W6691CD

更新时间: 2024-11-06 03:17:31
品牌 Logo 应用领域
华邦 - WINBOND 综合业务数字网
页数 文件大小 规格书
106页 466K
描述
ISDN S/T Interface Transceiver

W6691CD 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:10 X 10 MM, 1.40 MM, LQFP-64
针数:64Reach Compliance Code:not_compliant
HTS代码:8542.39.00.01风险等级:5.92
数据速率:144 MbpsISDN访问速率:BASIC
JESD-30 代码:S-PQFP-G64JESD-609代码:e0
长度:10 mm功能数量:1
端子数量:64最高工作温度:70 °C
最低工作温度:最小输出高电压:2.4 V
最大输出低电流:0.012 A最大输出低电压:0.4 V
封装主体材料:PLASTIC/EPOXY封装代码:LFQFP
封装等效代码:QFP64,.47SQ,20封装形状:SQUARE
封装形式:FLATPACK, LOW PROFILE, FINE PITCH峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V认证状态:Not Qualified
参照点:S/T座面最大高度:1.6 mm
子类别:Digital Transmission Interfaces标称供电电压:5 V
表面贴装:YES技术:CMOS
电信集成电路类型:TELECOM CIRCUIT温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:10 mm
Base Number Matches:1

W6691CD 数据手册

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W6691 Preliminary  
ISDN S/T Interface Transceiver  
W6691 ISDN S/T Interface Transceiver  
Data Sheet  
The information described in this document is the exclusive intellectual property of Winbond Electronics  
Corp and shall not be reproduced without permission from Winbond.  
Winbond is providing this document only for reference purposes for W6691-based system design. Winbond  
assumes no responsibility for errors or omissions. All data and specifications are subject to change without  
notice.  
Publication Release Date: Sep 2001  
1
Revision 1.1  

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