生命周期: | Obsolete | 零件包装代码: | TSOP1 |
包装说明: | TSOP1, | 针数: | 32 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.78 |
最长访问时间: | 55 ns | 其他特性: | CAN ALSO OPERATE AT 5V SUPPLY |
JESD-30 代码: | R-PDSO-G32 | JESD-609代码: | e3 |
长度: | 11.8 mm | 内存密度: | 1048576 bit |
内存集成电路类型: | STANDARD SRAM | 内存宽度: | 8 |
功能数量: | 1 | 端子数量: | 32 |
字数: | 131072 words | 字数代码: | 128000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -20 °C | 组织: | 128KX8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSOP1 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE |
并行/串行: | PARALLEL | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 3.465 V |
最小供电电压 (Vsup): | 3.135 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子面层: | MATTE TIN |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | DUAL | 宽度: | 8 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
W24L11Q-70L | WINBOND |
获取价格 |
128K X 8 High Speed CMOS Static RAM | |
W24L11Q-70LE | WINBOND |
获取价格 |
Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 8 X 13.40 MM, TSOP1-32 | |
W24L11Q-70LL | WINBOND |
获取价格 |
128K X 8 High Speed CMOS Static RAM | |
W24L11S-55L | WINBOND |
获取价格 |
Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 0.450 INCH, SOP-32 | |
W24L11S-70L | WINBOND |
获取价格 |
128K X 8 High Speed CMOS Static RAM | |
W24L11S-70LE | WINBOND |
获取价格 |
Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 0.450 INCH, SOP-32 | |
W24L11S-70LL | WINBOND |
获取价格 |
128K X 8 High Speed CMOS Static RAM | |
W24L11T-55L | WINBOND |
获取价格 |
Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | |
W24L11T-55LE | WINBOND |
获取价格 |
Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | |
W24L11T-55LL | WINBOND |
获取价格 |
Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 |