是否Rohs认证: | 符合 | 生命周期: | Obsolete |
包装说明: | FBGA, BGA40,7X7,20 | Reach Compliance Code: | unknown |
风险等级: | 5.3 | JESD-30 代码: | S-PBGA-B40 |
端子数量: | 40 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | FBGA | 封装等效代码: | BGA40,7X7,20 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, FINE PITCH |
电源: | 3.3 V | 认证状态: | Not Qualified |
子类别: | Bus Controllers | 标称供电电压: | 3.3 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
USB3300 | SMSC |
获取价格 |
HI SPEED USB HOST OR DEVICE PHY WITH ULPI LOW PIN INTERFACE | |
USB3300_06 | SMSC |
获取价格 |
Hi-Speed USB Host, Device or OTG PHY with ULPI Low Pin Interface | |
USB3300_07 | SMSC |
获取价格 |
Hi-Speed USB Host, Device or OTG PHY with ULPI Low Pin Interface | |
USB3300-EZK | MICROCHIP |
获取价格 |
Hi-Speed USB Host, Device or OTG PHY with ULPI Low Pin Interface | |
USB3300-EZK | SMSC |
获取价格 |
HI SPEED USB HOST OR DEVICE PHY WITH ULPI LOW PIN INTERFACE | |
USB3300-EZK-CAG | MICROCHIP |
获取价格 |
暂无描述 | |
USB3300-EZK-TR | MICROCHIP |
获取价格 |
暂无描述 | |
USB3300I-EZK | MICROCHIP |
获取价格 |
DATACOM, INTERFACE CIRCUIT | |
USB3300I-EZK-TR | MICROCHIP |
获取价格 |
DATACOM, INTERFACE CIRCUIT | |
USB3310C-CP | MICROCHIP |
获取价格 |
IC TXRX USB 2.0 ULPI 24VQFN |