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USB3300I-EZK-TR PDF预览

USB3300I-EZK-TR

更新时间: 2024-02-25 05:45:01
品牌 Logo 应用领域
美国微芯 - MICROCHIP 电信电信集成电路
页数 文件大小 规格书
53页 972K
描述
DATACOM, INTERFACE CIRCUIT

USB3300I-EZK-TR 技术参数

生命周期:Active包装说明:HVQCCN,
Reach Compliance Code:compliant风险等级:5.75
JESD-30 代码:S-PQCC-N32长度:5 mm
功能数量:1端子数量:32
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
筛选级别:TS 16949座面最大高度:1 mm
标称供电电压:3.3 V表面贴装:YES
电信集成电路类型:INTERFACE CIRCUIT温度等级:INDUSTRIAL
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD宽度:5 mm
Base Number Matches:1

USB3300I-EZK-TR 数据手册

 浏览型号USB3300I-EZK-TR的Datasheet PDF文件第2页浏览型号USB3300I-EZK-TR的Datasheet PDF文件第3页浏览型号USB3300I-EZK-TR的Datasheet PDF文件第4页浏览型号USB3300I-EZK-TR的Datasheet PDF文件第5页浏览型号USB3300I-EZK-TR的Datasheet PDF文件第6页浏览型号USB3300I-EZK-TR的Datasheet PDF文件第7页 
USB3300  
Hi-Speed USB Host, Device or OTG PHY with  
ULPI Low Pin Interface  
• Low Latency Hi-Speed Receiver (43 Hi-Speed  
clocks Max) allows use of legacy UTMI Links with  
a ULPI wrapper  
Product Features  
• USB-IF Hi-Speed certified to the Universal Serial  
Bus Specification Rev 2.0  
• Integrated Pull-up resistor on STP for interface  
protection allows a reliable Link/PHY start-up with  
slow Links (software configured for low power)  
• Interface compliant with the ULPI Specification  
revision 1.1 in 8-bit mode  
• Industry standard UTMI+ Low Pin Interface (ULPI)  
Converts 54 UTMI+ signals into a standard 12 pin  
Link controller interface  
• Internal 1.8 volt regulators allow operation from a  
single 3.3 volt supply  
• Internal short circuit protection of ID, DP and DM  
lines to VBUS or ground  
• 54.7mA Unconfigured Current (typical) - ideal for  
bus powered applications  
• Integrated 24MHz Crystal Oscillator supports  
either crystal operation or 24MHz external clock  
input  
• 83uA suspend current (typical) - ideal for battery  
powered applications  
• Latch-Up performance exceeds 150 mA per EIA/  
JESD 78, Class II  
• Internal PLL for 480MHz Hi-Speed USB operation  
• Industrial Operating Temperature -40°C to +85°C  
• 32 pin, QFN RoHS Compliant package  
(5 x 5 x 0.90 mm height)  
• ESD protection levels of 8kV HBM without exter-  
nal protection devices  
• Integrated protection to withstand IEC61000-4-2  
ESD tests ( 8kV contact and 15kV air) per 3rd  
party test facility  
Applications  
The USB3300 is the ideal companion to any ASIC, SoC  
or FPGA solution designed with a ULPI Hi-Speed USB  
host, peripheral or OTG core.  
• Supports FS pre-amble for FS hubs with a LS  
device attached (UTMI+ Level 3)  
• Supports HS SOF and LS keep-alive pulse  
The USB3300 is well suited for:  
• Includes full support for the optional On-The-Go  
(OTG) protocol detailed in the On-The-Go Sup-  
plement Revision 1.0a specification  
• Cell Phones  
• PDAs  
• MP3 Players  
• Supports the OTG Host Negotiation Protocol  
(HNP) and Session Request Protocol (SRP)  
• Scanners  
• Allows host to turn VBUS off to conserve battery  
power in OTG applications  
• External Hard Drives  
• Digital Still and Video Cameras  
• Portable Media Players  
• Printers  
• Supports OTG monitoring of VBUS levels with  
internal comparators. Includes support for an  
external VBUS or fault monitor.  
2014 Microchip Technology Inc.  
DS00001783A-page 1  

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