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USB3300-EZK PDF预览

USB3300-EZK

更新时间: 2024-11-18 12:02:55
品牌 Logo 应用领域
美国微芯 - MICROCHIP 电信集成电路
页数 文件大小 规格书
59页 676K
描述
Hi-Speed USB Host, Device or OTG PHY with ULPI Low Pin Interface

USB3300-EZK 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN,针数:32
Reach Compliance Code:compliantHTS代码:8542.39.00.01
Factory Lead Time:11 weeks风险等级:1.7
JESD-30 代码:S-XQCC-N32JESD-609代码:e3
长度:5 mm湿度敏感等级:3
功能数量:1端子数量:32
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260座面最大高度:1 mm
标称供电电压:3.3 V表面贴装:YES
电信集成电路类型:INTERFACE CIRCUIT温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn) - annealed端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:40宽度:5 mm
Base Number Matches:1

USB3300-EZK 数据手册

 浏览型号USB3300-EZK的Datasheet PDF文件第2页浏览型号USB3300-EZK的Datasheet PDF文件第3页浏览型号USB3300-EZK的Datasheet PDF文件第4页浏览型号USB3300-EZK的Datasheet PDF文件第5页浏览型号USB3300-EZK的Datasheet PDF文件第6页浏览型号USB3300-EZK的Datasheet PDF文件第7页 
USB3300  
Hi-Speed USB Host, Device or OTG PHY  
with ULPI Low Pin Interface  
Datasheet  
PRODUCT FEATURES  
USB-IF Hi-Speed certified to the Universal Serial Bus  
Specification Rev 2.0  
Low Latency Hi-Speed Receiver (43 Hi-Speed clocks  
Max) allows use of legacy UTMI Links with a ULPI  
wrapper  
Interface compliant with the ULPI Specification  
revision 1.1 in 8-bit mode  
Integrated Pull-up resistor on STP for interface  
protection allows a reliable Link/PHY start-up with  
slow Links (software configured for low power)  
Industry standard UTMI+ Low Pin Interface (ULPI)  
Converts 54 UTMI+ signals into a standard 12 pin  
Link controller interface  
Internal 1.8 volt regulators allow operation from a  
single 3.3 volt supply  
54.7mA Unconfigured Current (typical) - ideal for bus  
powered applications  
Internal short circuit protection of ID, DP and DM  
lines to VBUS or ground  
83uA suspend current (typical) - ideal for battery  
powered applications  
Integrated 24MHz Crystal Oscillator supports either  
crystal operation or 24MHz external clock input  
Latch-Up performance exceeds 150 mA per  
EIA/JESD 78, Class II  
Internal PLL for 480MHz Hi-Speed USB operation  
ESD protection levels of 8kV HBM without external  
protection devices  
Industrial Operating Temperature -40°C to +85°C  
32 pin, QFN lead-free RoHS Compliant package  
(5 x 5 x 0.90 mm height)  
Integrated protection to withstand IEC61000-4-2 ESD  
tests ( 8kV contact and 15kV air) per 3rd party test  
facility  
Applications  
Supports FS pre-amble for FS hubs with a LS device  
attached (UTMI+ Level 3)  
The USB3300 is the ideal companion to any ASIC, SoC  
or FPGA solution designed with a ULPI Hi-Speed USB  
host, peripheral or OTG core.  
Supports HS SOF and LS keep-alive pulse  
Includes full support for the optional On-The-Go  
(OTG) protocol detailed in the On-The-Go  
Supplement Revision 1.0a specification  
The USB3300 is well suited for:  
Cell Phones  
PDAs  
Supports the OTG Host Negotiation Protocol (HNP)  
and Session Request Protocol (SRP)  
MP3 Players  
Allows host to turn VBUS off to conserve battery  
power in OTG applications  
Scanners  
External Hard Drives  
Digital Still and Video Cameras  
Portable Media Players  
Printers  
Supports OTG monitoring of VBUS levels with  
internal comparators. Includes support for an external  
VBUS or fault monitor.  
SMSC USB3300  
Revision 1.1 (01-24-13)  
DATASHEET  

USB3300-EZK 替代型号

型号 品牌 替代类型 描述 数据表
USB3300-EZK-TR MICROCHIP

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