是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | VFBGA, | 针数: | 25 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.75 | Is Samacsys: | N |
JESD-30 代码: | S-PBGA-B25 | JESD-609代码: | e1 |
长度: | 3 mm | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 25 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 座面最大高度: | 1 mm |
标称供电电压: | 1.8 V | 表面贴装: | YES |
电信集成电路类型: | INTERFACE CIRCUIT | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 3 mm |
Base Number Matches: | 1 |
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USB3317-CP-TR | MICROCHIP |
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IC TXRX 1.8V-3.3V ULPI 24VQFN |