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UPG2314T5N PDF预览

UPG2314T5N

更新时间: 2024-10-30 03:23:19
品牌 Logo 应用领域
CEL /
页数 文件大小 规格书
7页 1253K
描述
GaAs HBT INTEGRATED CIRCUIT

UPG2314T5N 数据手册

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PRELIMINARY DATA SHEET  
GaAs HBT INTEGRATED CIRCUIT  
uPG2314T5N  
POWER AMPLIFIER FOR BluetoothTM Class1  
DESCRIPTION  
The uPG2314T5N is a GaAs HBT MMIC power amplifier which was developed for BluetoothTM Class1.  
This device realizes high efficiency, high gain and high output power by using InGaP HBT.  
This device is housed in a 6-pin TSON Thin Small Out-line Non-Leaded package. And this package is able to high-density  
surface mounting.  
FEATURES  
Operating Frequency  
: fopt = 2400 to 2500MHz 2450MHz TYP.  
: VCC1,2 = 2.7 to 3.6V 3.0V TYP.  
: Vcont = 0 to 3.6V 3.0V TYP.  
Supply Voltage  
Control Voltage  
: Vbias + Venable = 0 to 3.1V 3.0V TYP.  
Circuit Current  
Output Power  
Gain Control Range  
High Efficiency  
: ICC = 65mA TYP. @ VCC1,2 = 3.0V, Vbias + Venable = 3.0V, Vcont = 3.0V, Pin = 0dBm  
: Pout = +20.0dBm TYP.@ VCC1,2 = 3.0V, Vbias + Venable = 3.0V, Vcont = 3.0V, Pin = 0dBm  
: GCR = 23dB TYP.@ VCC1,2 = 3.0V, Vbias + Venable = 3.0V, Vcont = 0 to 3.0V, Pin = 0dBm  
: PAE = 50 TYP.  
High-density surface mounting : 6-pin TSON package 1.5  
1.5  
0.37 mm  
APPLICATION  
Power Amplifier for BluetoothTM Class1  
ORDERING INFORMATION  
Part Number  
Order Number  
Package  
Marking  
G5D  
Supplying Form  
uPG2314T5N – E2  
uPG2314T5N – E2  
A
6-pin plastic TSON  
Pb-Free  
Embossed tape 8 mm wide  
Pin1,6 face the perforation side of tape  
Qty 3kpcs/reel  
Remark To order evaluation samples, contact your nearby sales office.  
Part number for sample order : uPG2314T5N  
Caution Electro-static sensitive devices  
The information in this document is subject to change without notice. Before using this document, please confirm  
that this is the latest version.  
Document No. PG*****EJW8V0PDS ( 8th edition )  
Date Published April 2006 CP(K)  

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