Datasheet > UPG2314T5N_0607

UPG2314T5N_0607

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
CEL		放大器功率放大器蓝牙
页数	文件大小	规格书
10页	288K
描述
POWER AMPLIFIER FOR BluetoothTM Class 1

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中文翻译

获取价格

数据手册

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UPG2314T5N_0607 数据手册

GaAs HBT INTEGRATED CIRCUIT

µPG2314T5N

POWER AMPLIFIER FOR Bluetooth^TMClass 1

DESCRIPTION

The µPG2314T5N is GaAs HBT MMIC for power amplifier which was developed for Bluetooth Class 1.

This device realizes high efficiency, high gain and high output power by using InGaP HBT. This device is housed in

a 6-pin plastic TSON (Thin Small Out-line Non-leaded) package. And this package is able to high-density surface

mounting.

FEATURES

•

Operation frequency

Supply voltage

: fopt = 2 400 to 2 500 MHz (2 450 MHz TYP.)

: V^CC1, 2 = 2.7 to 3.6 V (3.0 V TYP.)

Control voltage

: V^cont= 0 to 3.6 V (3.0 V TYP.)

: V^bias+ Venable = 0 to 3.1 V (3.0 V TYP.)

: I^CC= 65 mA TYP. @ VCC1, 2 = 3.0 V, Vbias + Venable = 3.0 V, Vcont = 3.0 V,

Pⁱⁿ= 0 dBm

•

Circuit current

Output power

: P^out= +20 dBm TYP. @ VCC1, 2 = 3.0 V, Vbias + Venable = 3.0 V, Vcont = 3.0 V,

Pⁱⁿ= 0 dBm

Gain control range

: GCR = 23 dB TYP. @ V^CC1, 2 = 3.0 V, Vbias + Venable = 3.0 V, Vcont = 0 to 3.0 V,

Pⁱⁿ= 0 dBm

•

High efficiency

: PAE = 50% TYP.

High-density surface mounting : 6-pin plastic TSON package (1.5 × 1.5 × 0.37 mm)

APPLICATIONS

•

Power Amplifier for Bluetooth Class 1

ORDERING INFORMATION

Part Number

Order Number

Package

Marking

G5D

Supplying Form

• Embossed tape 8 mm wide

µPG2314T5N-E2 µPG2314T5N-E2-A 6-pin plastic TSON

(Pb-Free)

• Pin 1, 6 face the perforation side of the tape

• Qty 3 kpcs/reel

Remark To order evaluation samples, contact your nearby sales office.

Part number for sample order: µPG2314T5N

Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.

Document No. PG10624EJ01V0DS (1st edition)

Date Published July 2006 NS CP(K)

12 3 4 5 6 7...10

中文翻译

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