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UPG2315T5T-E2-A PDF预览

UPG2315T5T-E2-A

更新时间: 2024-10-30 20:02:07
品牌 Logo 应用领域
日电电子 - NEC 局域网无线电信ISM频段电信集成电路
页数 文件大小 规格书
14页 115K
描述
Wireless LAN Circuit, PQCC16, 3 X 3 MM, 0.75 MM HEIGHT, PLASTIC, QFN-16

UPG2315T5T-E2-A 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:QFN
包装说明:HVQCCN,针数:16
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.81JESD-30 代码:S-PQCC-N16
JESD-609代码:e6长度:3 mm
功能数量:1端子数量:16
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
座面最大高度:0.85 mm标称供电电压:3.3 V
表面贴装:YES电信集成电路类型:WIRELESS LAN CIRCUIT
温度等级:INDUSTRIAL端子面层:TIN BISMUTH
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3 mmBase Number Matches:1

UPG2315T5T-E2-A 数据手册

 浏览型号UPG2315T5T-E2-A的Datasheet PDF文件第2页浏览型号UPG2315T5T-E2-A的Datasheet PDF文件第3页浏览型号UPG2315T5T-E2-A的Datasheet PDF文件第4页浏览型号UPG2315T5T-E2-A的Datasheet PDF文件第5页浏览型号UPG2315T5T-E2-A的Datasheet PDF文件第6页浏览型号UPG2315T5T-E2-A的Datasheet PDF文件第7页 
DATA SHEET  
GaAs HBT INTEGRATED CIRCUIT  
μPG2315T5T  
2.4 GHz SINGLE BAND POWER AMPLIFIER FOR W-LAN  
DESCRIPTION  
The μPG2315T5T is GaAs HBT MMIC power amplifier which were developed for W-LAN.  
This device realizes high efficiency, high gain and high output power by using InGaP HBT. This device is housed in  
a 16-pin plastic QFN (Quad Flat Non-leaded) package. And this package is able to high-density surface mounting.  
FEATURES  
Operation frequency  
Supply voltage  
Control voltage  
Circuit current  
: fopt = 2 400 to 2 500 MHz (2 450 MHz TYP.)  
: VCC1, 2 = 3.0 to 3.6 V (3.3 V TYP.)  
: Venable = 0 to 2.95 V (2.85 V TYP.)  
: ICC = 130 mA TYP. @ VCC1, 2 = 3.3 V, Venable = 2.85 V,  
Pout = +18 dBm (at OFDM modulation)  
Power gain  
: GP = 26 dB TYP. @ VCC1, 2 = 3.3 V, Venable = 2.85 V,  
Pout = +18 dBm (at OFDM modulation)  
Gain flatness  
: ΔGP = 1.0 dB TYP. @ f = 2.4 to 2.5 GHz, VCC1, 2 = 3.3 V, Venable = 2.85 V,  
Pout = +18 dBm (at OFDM modulation)  
Error vector magnitude  
Harmonics  
: EVM = 3% TYP. @ VCC1, 2 = 3.3 V, Venable = 2.85 V,  
Pout = +18 dBm (at OFDM modulation)  
: 2f0, 3f0, 4f0 = 30 dBc TYP. @ VCC1, 2 = 3.3 V, Venable = 2.85 V,  
Pout = +18 dBm (at OFDM modulation)  
High-density surface mounting : 16-pin plastic QFN package (3.0 × 3.0 × 0.75 mm)  
APPLICATIONS  
Power Amplifier for W-LAN (802.11 b/g) and DECT  
ORDERING INFORMATION  
Part Number  
Order Number  
Package  
Marking  
2315  
Supplying Form  
Embossed tape 8 mm wide  
μPG2315T5T-E2 μPG2315T5T-E2-A 16-pin plastic QFN  
(Pb-Free)  
Pin 1, 12 face the perforation side of the tape  
Qty 3 kpcs/reel  
Remark To order evaluation samples, contact your nearby sales office.  
Part number for sample order: μPG2315T5T  
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all products and/or types are available in every country. Please check with an NEC Electronics  
sales representative for availability and additional information.  
Document No. PG10625EJ01V0DS (1st edition)  
Date Published July 2006 NS CP(K)  
Printed in Japan  
2006  

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