是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | 14 X 14 MM, LEAD FREE, PLASTIC, QFP-100 | Reach Compliance Code: | compliant |
风险等级: | 5.8 | Is Samacsys: | N |
具有ADC: | YES | 地址总线宽度: | 20 |
位大小: | 32 | 最大时钟频率: | 33 MHz |
DAC 通道: | YES | DMA 通道: | NO |
外部数据总线宽度: | 16 | JESD-30 代码: | S-PQFP-G100 |
JESD-609代码: | e6/e4 | 长度: | 14 mm |
I/O 线路数量: | 117 | 端子数量: | 100 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFQFP | 封装形状: | SQUARE |
封装形式: | FLATPACK, LOW PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | ROM可编程性: | MROM |
座面最大高度: | 1.6 mm | 速度: | 33 MHz |
最大供电电压: | 5.5 V | 最小供电电压: | 4.5 V |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | MOS | 温度等级: | INDUSTRIAL |
端子面层: | TIN BISMUTH/NICKEL PALLADIUM GOLD | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 10 | 宽度: | 14 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
UPD703030AGF-XXX-3BA | ETC |
获取价格 |
Microcontroller | |
UPD703030AYGF-XXX-3BA | ETC |
获取价格 |
Microcontroller | |
UPD703030B | ETC |
获取价格 |
V850/SB1(TM).V850/SB2(TM) for Hardware | UM Including Electrical Characteristics[02/2003] | |
UPD703030BY | ETC |
获取价格 |
V850 Series Pamphlet | Pamphlet[02/2002] | |
UPD703030BYGC-XXX-8EU | RENESAS |
获取价格 |
IC,MICROCONTROLLER,32-BIT,V850 CPU,CMOS,QFP,100PIN,PLASTIC | |
UPD703030BYGF-XXX-3BA | RENESAS |
获取价格 |
IC,MICROCONTROLLER,32-BIT,V850 CPU,CMOS,QFP,100PIN,PLASTIC | |
UPD703031A | NEC |
获取价格 |
V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS | |
UPD703031AGC | NEC |
获取价格 |
V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS | |
UPD703031AGC-XXX-8EU | NEC |
获取价格 |
Microcontroller, 32-Bit, MROM, 20MHz, MOS, PQFP100, 14 X 14 MM, FINE PITCH, PLASTIC, LQFP- | |
UPD703031AGF | NEC |
获取价格 |
V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |