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UPD703030BYGF-XXX-3BA PDF预览

UPD703030BYGF-XXX-3BA

更新时间: 2024-10-30 15:56:11
品牌 Logo 应用领域
瑞萨 - RENESAS 微控制器
页数 文件大小 规格书
668页 5079K
描述
IC,MICROCONTROLLER,32-BIT,V850 CPU,CMOS,QFP,100PIN,PLASTIC

UPD703030BYGF-XXX-3BA 技术参数

生命周期:Obsolete包装说明:QFP, QFP100,.7X.9
Reach Compliance Code:unknown风险等级:5.84
Is Samacsys:N位大小:32
CPU系列:V850JESD-30 代码:R-PQFP-G100
端子数量:100最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:QFP封装等效代码:QFP100,.7X.9
封装形状:RECTANGULAR封装形式:FLATPACK
电源:3.3/5,5 V认证状态:Not Qualified
RAM(字节):24576ROM(单词):98304
ROM可编程性:MROM速度:20 MHz
子类别:Microcontrollers表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.635 mm
端子位置:QUADBase Number Matches:1

UPD703030BYGF-XXX-3BA 数据手册

 浏览型号UPD703030BYGF-XXX-3BA的Datasheet PDF文件第2页浏览型号UPD703030BYGF-XXX-3BA的Datasheet PDF文件第3页浏览型号UPD703030BYGF-XXX-3BA的Datasheet PDF文件第4页浏览型号UPD703030BYGF-XXX-3BA的Datasheet PDF文件第5页浏览型号UPD703030BYGF-XXX-3BA的Datasheet PDF文件第6页浏览型号UPD703030BYGF-XXX-3BA的Datasheet PDF文件第7页 
User’s Manual  
V850/SB1TM, V850/SB2TM  
32-Bit Single-Chip Microcontroller  
Hardware  
µPD703031A  
µPD703031AY µPD703030BY µPD703034AY µPD703034BY  
µPD703032A µPD703031B µPD703035A µPD703035B  
µPD703032AY µPD703031BY µPD703035AY µPD703035BY  
µPD703033A µPD703032B µPD703037A µPD703036H  
µPD703033AY µPD703032BY µPD703037AY µPD703036HY  
µPD70F3032A µPD703033B µPD70F3035A µPD703037H  
µPD703030B  
µPD703034A  
µPD703034B  
µPD70F3032AY µPD703033BY µPD70F3035AY µPD703037HY  
µPD70F3033A µPD70F3030B µPD70F3037A µPD70F3035B  
µPD70F3033AY µPD70F3030BY µPD70F3037AY µPD70F3035BY  
µPD70F3032B  
µPD70F3032BY  
µPD70F3033B  
µPD70F3033BY  
µPD70F3036H  
µPD70F3036HY  
µPD70F3037H  
µPD70F3037HY  
Document No. U13850EJ6V0UD00 (6th edition)  
Date Published February 2003 N CP(K)  
1999, 2000, 2003  
Printed in Japan  

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V850/SB1(TM).V850/SB2(TM) for Hardware | UM Including Electrical Characteristics[02/2003]