是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | LBGA, | Reach Compliance Code: | compliant |
风险等级: | 5.79 | 其他特性: | PIPELINED ARCHITECTURE |
JESD-30 代码: | R-PBGA-B165 | JESD-609代码: | e1 |
长度: | 17 mm | 内存密度: | 75497472 bit |
内存集成电路类型: | DDR SRAM | 内存宽度: | 36 |
功能数量: | 1 | 端子数量: | 165 |
字数: | 2097152 words | 字数代码: | 2000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 2MX36 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, LOW PROFILE |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 座面最大高度: | 1.51 mm |
最大供电电压 (Vsup): | 1.9 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | TIN SILVER COPPER | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 15 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
UPD44646366F5-E25-FQ1-A | NEC |
获取价格 |
DDR SRAM, 2MX36, CMOS, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165 | |
UPD44646366F5-E27-FQ1 | NEC |
获取价格 |
DDR SRAM, 2MX36, CMOS, PBGA165, 15 X 17 MM, PLASTIC, BGA-165 | |
UPD44646366F5-E27-FQ1-A | NEC |
获取价格 |
DDR SRAM, 2MX36, CMOS, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165 | |
UPD44646366F5-E30-FQ1 | NEC |
获取价格 |
DDR SRAM, 2MX36, CMOS, PBGA165, 15 X 17 MM, PLASTIC, BGA-165 | |
UPD44646366F5-E30-FQ1-A | NEC |
获取价格 |
DDR SRAM, 2MX36, CMOS, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165 | |
UPD44646366F5-E33-FQ1 | NEC |
获取价格 |
DDR SRAM, 2MX36, CMOS, PBGA165, 15 X 17 MM, PLASTIC, BGA-165 | |
UPD44646366F5-E33-FQ1-A | NEC |
获取价格 |
DDR SRAM, 2MX36, CMOS, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165 | |
UPD44646367F5-E25-FQ1-A | NEC |
获取价格 |
DDR SRAM, 2MX36, CMOS, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165 | |
UPD44647094AF5-E30-FQ1-A | RENESAS |
获取价格 |
IC,SYNC SRAM,QDR,8MX9,CMOS,BGA,165PIN,PLASTIC | |
UPD44647094AF5-E33-FQ1-A | RENESAS |
获取价格 |
IC,SYNC SRAM,QDR,8MX9,CMOS,BGA,165PIN,PLASTIC |