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UPD44646364F5-E27-FQ1 PDF预览

UPD44646364F5-E27-FQ1

更新时间: 2024-11-22 04:27:51
品牌 Logo 应用领域
日电电子 - NEC 双倍数据速率静态存储器内存集成电路
页数 文件大小 规格书
36页 401K
描述
DDR SRAM, 2MX36, CMOS, PBGA165, 15 X 17 MM, PLASTIC, BGA-165

UPD44646364F5-E27-FQ1 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:LBGA,针数:165
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.87
其他特性:PIPELINED ARCHITECTUREJESD-30 代码:R-PBGA-B165
JESD-609代码:e0长度:17 mm
内存密度:75497472 bit内存集成电路类型:DDR SRAM
内存宽度:36功能数量:1
端子数量:165字数:2097152 words
字数代码:2000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:2MX36封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
座面最大高度:1.51 mm最大供电电压 (Vsup):1.9 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:TIN LEAD
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:15 mm

UPD44646364F5-E27-FQ1 数据手册

 浏览型号UPD44646364F5-E27-FQ1的Datasheet PDF文件第2页浏览型号UPD44646364F5-E27-FQ1的Datasheet PDF文件第3页浏览型号UPD44646364F5-E27-FQ1的Datasheet PDF文件第4页浏览型号UPD44646364F5-E27-FQ1的Datasheet PDF文件第5页浏览型号UPD44646364F5-E27-FQ1的Datasheet PDF文件第6页浏览型号UPD44646364F5-E27-FQ1的Datasheet PDF文件第7页 
PRELIMINARY DATA SHEET  
MOS INTEGRATED CIRCUIT  
μPD44646094, 44646184, 44646364, 44646096, 44646186, 44646366  
72M-BIT DDR II+ SRAM  
2.0 & 2.5 Cycle Read Latency  
4-WORD BURST OPERATION  
Description  
The μPD44646094 and μPD44646096 are 8,388,608-word by 9-bit, the μPD44646184 and μPD44646186 are  
4,194,304-word by 18-bit and the μPD44646364 and μPD44646366 are 2,097,152-word by 36-bit synchronous double  
data rate static RAMs fabricated with advanced CMOS technology using full CMOS six-transistor memory cell.  
The μPD44646xx4 is for 2.0 cycle and the μPD44646xx6 is for 2.5 cycle read latency. The μPD44646094, μPD44646096,  
μPD44646184, μPD44646186, μPD44646364 and μPD44646366 integrate unique synchronous peripheral circuitry and a  
burst counter. All input registers controlled by an input clock pair (K and K#) are latched on the positive edge of K and K#.  
These products are suitable for application which require synchronous operation, high speed, low voltage, high density  
and wide bit configuration.  
These products are packaged in 165-pin PLASTIC BGA.  
Features  
Core (VDD) = 1.8 ± 0.1 V power supply  
I/O (VDDQ) = 1.5 ± 0.1 V power supply  
165-pin PLASTIC BGA (15x17)  
HSTL interface  
PLL circuitry for wide output data valid window and future frequency scaling  
Pipelined double data rate operation  
Common data input/output bus  
Four - tick burst for reduced address frequency  
Two input clocks (K and K#) for precise DDR timing at clock rising edges only  
Two Echo clocks (CQ and CQ#)  
Data Valid pin (QVLD) supported  
Read latency : 2.0 & 2.5 clock cycles (Not selectable by user)  
Internally self-timed write control  
Clock-stop capability. Normal operation is restored in 2,048 cycles after clock is resumed.  
User programmable impedance output (35 to 70 )  
Fast clock cycle time : 2.66 ns (375 MHz) for 2.0 cycle read latency,  
2.5 ns (400 MHz) for 2.5 cycle read latency  
Simple control logic for easy depth expansion  
JTAG 1149.1 compatible test access port  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all products and/or types are available in every country. Please check with an NEC Electronics  
sales representative for availability and additional information.  
Document No. M18524EJ1V0DS00 (1st edition)  
Date Published November 2006 NS CP(N)  
Printed in Japan  
2006  

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DDR SRAM, 2MX36, CMOS, PBGA165, 15 X 17 MM, PLASTIC, BGA-165
UPD44646366F5-E30-FQ1-A NEC

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DDR SRAM, 2MX36, CMOS, PBGA165, 15 X 17 MM, PLASTIC, BGA-165