UCLAMP3306P

更新时间： 2024-09-09 11:50:19

品牌	Logo	应用领域
商升特 - SEMTECH		电视
页数	文件大小	规格书
8页	201K
描述
Low Voltage TVS for ESD Protection

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UCLAMP3306P 数据手册

uClamp3306P

Low Voltage TVS

for ESD Protection

PROTECTION PRODUCTS - MicroClamp^TM

Features

Description

The μClamp^TMseries of TVS arrays are designed to

protect sensitive electronics from damage or latch-up

due to ESD, lightning, and other voltage-induced

transient events. Each device will protect up to six lines

operating at 3.3 volts.

Transient protection for data lines to

IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)

IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)

Small package for use in portable electronics

Protects Six I/O

Working voltage: 3.3V

Low leakage current

Low operating and clamping voltages

Solid-state silicon-avalanche technology

The μClamp^TM3306P is a solid-state device designed

specifically for transient suppression. It is constructed

using Semtech’s proprietary EPD process technology.

The EPD process provides low standoff voltages with

significant reductions in leakage currents and capaci-

tance over traditional pn junction processes. They offer

desirable characteristics for board level protection

including fast response time, low clamping voltage and

no device degradation.

Mechanical Characteristics

SLP1616P6 package

RoHS/WEEE Compliant

Nominal Dimensions: 1.6 x 1.6 x 0.58 mm

Lead Pitch: 0.5mm

The μClamp3306P may be used to meet the immunity

requirements of IEC 61000-4-2, level 4 (±15kV air,

±8kV contact discharge). It is packaged in an ultra

small SLP1616P6 package with a low profile of only

0.58mm. The leads are spaced at a pitch of 0.5mm

and are finished with lead-free NiPd. The small package

makes it ideal for use in portable electronics such as cell

phones, digital still cameras, and notebook computers.

Lead Finish: NiPd

Marking : Orientation Mark and Marking Code

Packaging : Tape and Reel per EIA 481

Applications

Cellular handsets and accessories

Notebooks and handhelds

MP3 Players

Digital cameras

Portable instrumentation

Circuit Diagram

Package

1.6

0.5

0.6

Center Tab (GND)

Device Schematic

6 Pin SLP package (Bottom Side View)

1.6 x 1.6 x 0.58mm (Nominal)

www.semtech.com

Revision 01/17/2007

12 3 4 5 6 7 8

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