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UCLAMP3306P.TCT

更新时间： 2024-11-04 05:52:51
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商升特 - SEMTECH 瞬态抑制器二极管电视光电二极管PC局域网
页数 文件大小 规格书
8页 201K
描述
Low Voltage TVS for ESD Protection

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中文翻译

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UCLAMP3306P.TCT 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：DFN
包装说明：1.60 X 1.60 MM, 0.58 MM HEIGHT, ROHS COMPLIANT, SLP-6针数：6
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8541.10.00.50风险等级：1.73
Samacsys Confidence：3Samacsys Status：Released
Samacsys PartID：1214186Samacsys Pin Count：7
Samacsys Part Category：Integrated CircuitSamacsys Package Category：Small Outline No-lead
Samacsys Footprint Name：RCLAMP0854P.TCTSamacsys Released Date：2020-01-20 11:16:53
Is Samacsys：N其他特性：LOW LEAKAGE CURRENT
最大钳位电压：5.5 V配置：COMMON ANODE, 6 ELEMENTS
二极管元件材料：SILICON二极管类型：TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码：R-PDSO-N6JESD-609代码：e4
湿度敏感等级：1最大非重复峰值反向功率耗散：40 W
元件数量：6端子数量：6
最高工作温度：125 °C最低工作温度：-55 °C
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：SMALL OUTLINE峰值回流温度（摄氏度）：260
极性：UNIDIRECTIONAL认证状态：Not Qualified
最大重复峰值反向电压：3.3 V子类别：Transient Suppressors
表面贴装：YES技术：AVALANCHE
端子面层：NICKEL PALLADIUM GOLD端子形式：NO LEAD
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
Base Number Matches：1

UCLAMP3306P.TCT 数据手册

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uClamp3306P  
Low Voltage TVS  
for ESD Protection  
PROTECTION PRODUCTS - MicroClampTM  
Features  
Description  
The μClampTM series of TVS arrays are designed to  
protect sensitive electronics from damage or latch-up  
due to ESD, lightning, and other voltage-induced  
transient events. Each device will protect up to six lines  
operating at 3.3 volts.  
‹ Transient protection for data lines to  
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)  
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)  
‹ Small package for use in portable electronics  
‹ Protects Six I/O  
‹ Working voltage: 3.3V  
‹ Low leakage current  
‹ Low operating and clamping voltages  
‹ Solid-state silicon-avalanche technology  
The μClampTM3306P is a solid-state device designed  
specifically for transient suppression. It is constructed  
using Semtech’s proprietary EPD process technology.  
The EPD process provides low standoff voltages with  
significant reductions in leakage currents and capaci-  
tance over traditional pn junction processes. They offer  
desirable characteristics for board level protection  
including fast response time, low clamping voltage and  
no device degradation.  
Mechanical Characteristics  
‹ SLP1616P6 package  
‹ RoHS/WEEE Compliant  
‹ Nominal Dimensions: 1.6 x 1.6 x 0.58 mm  
‹ Lead Pitch: 0.5mm  
The μClamp3306P may be used to meet the immunity  
requirements of IEC 61000-4-2, level 4 (±15kV air,  
±8kV contact discharge). It is packaged in an ultra  
small SLP1616P6 package with a low profile of only  
0.58mm. The leads are spaced at a pitch of 0.5mm  
and are finished with lead-free NiPd. The small package  
makes it ideal for use in portable electronics such as cell  
phones, digital still cameras, and notebook computers.  
‹ Lead Finish: NiPd  
‹ Marking : Orientation Mark and Marking Code  
‹ Packaging : Tape and Reel per EIA 481  
Applications  
‹ Cellular handsets and accessories  
‹ Notebooks and handhelds  
‹ MP3 Players  
‹ Digital cameras  
‹ Portable instrumentation  
Circuit Diagram  
Package  
1.6  
1
2
1
3
5
6
4
1.6  
6
0.5  
0.6  
Center Tab (GND)  
Device Schematic  
6 Pin SLP package (Bottom Side View)  
1.6 x 1.6 x 0.58mm (Nominal)  
www.semtech.com  
Revision 01/17/2007  
1
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UCLAMP3306P.TCT 替代型号

型号 品牌 替代类型 描述 数据表
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UCLAMP0505A.TCT SEMTECH

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 μClampTM 5-Line ESD protection Array

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